公开(公告)号：US5156983A

公开(公告)日：1992-10-20

申请号：US427413

申请日：1989-10-26

申请人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

发明人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L24/86 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49126

摘要： This invention involves the selective plating of the outer leads in tape automated bonding section (TAB section). An inner and an outer gasket are mounted over, respectively, an inner and an outer portion of the outer leads and a voltage is applied to a common plane conductor. A barrier material, usually nickel, is applied to the outer leads protruding between the inner and the outer leads and then solder is applied over the nickel layer. The debus areas which connect all the outer leads to the common plane conductor are then excised from the TAB section which is now ready for final test.

摘要翻译： 本发明涉及在带式自动接合部分（TAB部分）中的外引线的选择性电镀。 内部和外部垫圈分别安装在外部引线的内部和外部部分上，并且将电压施加到公共平面导体。 将通常为镍的阻挡材料施加到突出在内引线和外引线之间的外引线，然后将焊料施加在镍层上。 将所有外部引线连接到公共平面导体的脱落区域然后从现在准备好进行最终测试的TAB部分切除。

公开(公告)号：US4854980A

公开(公告)日：1989-08-08

申请号：US134132

申请日：1987-12-17

申请人： Ramaswamy V. Raman ,  Shih C. Hsu

发明人： Ramaswamy V. Raman ,  Shih C. Hsu

IPC分类号： C22C45/10

CPC分类号： C22C45/10

摘要： A nickel-based glassy alloy composition including Mo and one or more of Nb, Ta, and Zr, exhibiting high hardness and high crystallization temperatures.

摘要翻译： 包含Mo和Nb，Ta和Zr中的一种或多种的镍基玻璃状合金组合物，具有高硬度和高结晶温度。

公开(公告)号：US5298464A

公开(公告)日：1994-03-29

申请号：US890984

申请日：1992-05-29

申请人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

发明人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L21/52 ,  H01L21/58 ,  H01L21/603

CPC分类号： H01L24/86 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49126

摘要： This invention resides in a curing process for adhesive on a housing member of a tape automated bonding section (TAB section). A force is applied to the housing member and then the entire TAB section is heated to a sufficient temperature and for a sufficient duration to cure the adhesive. The applied force, coupled with the heat squeezes a portion of the adhesive out from between the TAB section and the housing member and onto an inner portion of the outer leads before the adhesive cures. This embeds the inner portion of the outer leads with adhesive so that they are retained in alignment with and electrically isolated from each other.The manner in which the force is applied to the housing member during the curing process is also a novel feature of the invention. The TAB section within the carrier frame is placed on a pedestal in a mounting fixture. A compressor block is then disposed against the TAB section. A compressor bar clamped over the compressor block and to the mounting fixture urges the compressor block against the TAB section. This also causes a centrally-located spring loaded plunger within the compressor block to push against the semiconductor chip but with a reduced force. This reduced force presses the chip against a housing member aperture so that a silver epoxy mounted in the aperture can evenly disperse over the semiconductor chip.

摘要翻译： 本发明涉及一种用于胶带自动粘合部分（TAB部分）的外壳部件上的粘合剂的固化方法。 将力施加到壳体构件，然后将整个TAB区段加热至足够的温度并持续足够的时间固化粘合剂。 在粘合剂固化之前，所施加的力与热量挤压粘合剂的一部分从TAB部分和壳体部件之间挤压到外部引线的内部。 这使得外部引线的内部部分用粘合剂嵌入，使得它们保持与彼此对齐并且彼此电隔离。 在固化过程中将力施加到壳体构件的方式也是本发明的新颖特征。 载体框架内的TAB部分放置在安装夹具中的基座上。 然后将压缩机块设置在TAB部分上。 夹紧在压缩机组件和安装夹具上的压缩机杆促使压缩机块抵靠TAB部分。 这也使得压缩机组件内的位于中心的弹簧加载柱塞推压半导体芯片但是具有减小的力。 这种减小的力将芯片压靠住壳体构件孔，使得安装在孔中的银环氧树脂可以均匀地分散在半导体芯片上。

公开(公告)号：US4951829A

公开(公告)日：1990-08-28

申请号：US356321

申请日：1989-05-23

申请人： Shih C. Hsu

发明人： Shih C. Hsu

IPC分类号： B65D41/42

CPC分类号： B65D41/42

摘要： A crown cap for sealing bottles comprising a cap body including substantially a flat top, a crimped portion formed on the periphery of the cap body and an outwardly extending finger tab integrally connected to a part of the crimped portion and having a width of about 5 to 7 included teeth. A small notch is formed at the intersection between the basal end of the finger tab and the crimped portion, from which a score line extends upwardly along the crimped portion and passes slightly across the peripheral curved portion of the flat top and has an appropriate depth. The finger tab is formed at the margin with a pleated portion to strengthen the rigidity. The score line may be curved at the terminal end towards any of one side on the right or the left and may be additionally provided with a short score line perpendicular to the first score line. In this construction, the crown cap can be easily opened off of the mouth of a bottle by pulling the finger tab over with fingers.

公开(公告)号：US4678720A

公开(公告)日：1987-07-07

申请号：US895525

申请日：1986-08-11

申请人： Shih C. Hsu ,  Ramas V. Raman

发明人： Shih C. Hsu ,  Ramas V. Raman

IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K35/34 ,  B23K35/362 ,  C22C1/02 ,  C22C5/08

CPC分类号： B23K35/3006 ,  B23K35/0233 ,  Y10T428/12431 ,  Y10T428/12438

摘要： A silver-copper-titanium brazing alloy foil was produced by a rapid solidification processing method(s). The composition ranged from 10 to 50 weight percent copper, 0.1 to 9.5 weight percent titanium and the balance silver. Since the method provides high cooling rates, at least 10000.degree. C. per second, unique alloy structures and properties were obtained. This resulting foil can be used in the as cast form, it can be rolled down to a thinner dimension having also a more uniform surface finish, or it can be punched into preforms.

摘要翻译： 通过快速凝固处理方法制造银 - 铜 - 钛 - 钎焊合金箔。 组成范围为10至50重量％的铜，0.1至9.5重量％的钛和余量的银。 由于该方法提供高冷却速度，每秒至少10000℃，因此获得独特的合金结构和性能。 所得到的箔可以铸造形式使用，它可以被卷起到具有更均匀表面光洁度的更薄的尺寸，或者可以冲压成预制件。

公开(公告)号：US4603727A

公开(公告)日：1986-08-05

申请号：US623661

申请日：1984-06-22

申请人： Shih C. Hsu

发明人： Shih C. Hsu

IPC分类号： B22D11/06 ,  B22D41/14 ,  B22D39/00 ,  B22D41/10

CPC分类号： B22D41/14 ,  B22D11/064

摘要： Chill-cast metal foil is produced by an apparatus having a flexible gas permeable valve which provides a means for retaining the molten metal prior to processing it into a chill-cast metal foil and simultaneously providing a gas purging of the reservoir and the orifice in the reservoir to prevent formation of detrimental oxides of the molten metal by the exposure of the molten metal to air or oxygen containing atmosphere.A method for producing the chill-cast foil is also described.

摘要翻译： 冷却金属箔由具有柔性透气阀的装置制造，该装置提供用于在将熔融金属加工成冷铸金属箔之前保持熔融金属的装置，并同时提供储存器和孔中的气体吹扫 储存器，以通过将熔融金属暴露于空气或含氧气氛中来防止熔融金属的有害氧化物形成。 还描述了生产冷铸铝箔的方法。

公开(公告)号：US5068012A

公开(公告)日：1991-11-26

申请号：US556394

申请日：1990-07-24

申请人： Shih C. Hsu

发明人： Shih C. Hsu

IPC分类号： B41M1/12 ,  B41M1/30

CPC分类号： B41M1/12 ,  B41M1/30

摘要： A process is provided for providing a three dimensional multi-coating design having a predetermined thickness contour on plastic products. Initially, a coating is electroplated on a plastic plate member and an adhesive tape is positioned on top of the coating design. The combined coating design and adhesive tape is impacted and the adhesive tape is peeled from the plastic plate member. The adhesive tape is placed on a printing screen and desired colors are printed on the contour design. The coating design is covered with adhesive and then further cover with oilpaper and finally thermally printed on to a base material through a standard heat transfer process. In this manner, a three dimensional design coating having a predetermined thickness is provided on the base member.

摘要翻译： 提供了一种用于提供在塑料制品上具有预定厚度轮廓的三维多涂层设计的方法。 最初，将涂层电镀在塑料板构件上，并且胶带位于涂层设计的顶部。 组合的涂层设计和胶带被冲击，并且胶带从塑料板构件剥离。 胶带被放置在印刷屏幕上，并且所需的颜色印刷在轮廓设计上。 涂层设计用粘合剂覆盖，然后用油纸进一步覆盖，最后通过标准传热过程热印到基材上。 以这种方式，在基底构件上设置具有预定厚度的三维设计涂层。