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公开(公告)号:US5196500A
公开(公告)日:1993-03-23
申请号:US628769
申请日:1990-12-17
CPC分类号: H05K1/0346 , C08G73/1071 , H01L23/145 , H01L2924/0002 , Y10T428/31721
摘要: Tetrapolyimide films derived from 3,3',4,4'-benzophenone tetracarboxylic dianhydride, pyromellitic acid dianhydride, p-phenylene diamine and 4,4'-diaminodiphenyl ether, and their preparation, are described. The tetrapolymer films have low water absorption, low coefficients of thermal and hygroscopic expansion, high modulus and are caustic etachable and can be used in flexible printed circuit and tape automated bonding applications.
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公开(公告)号:US4906731A
公开(公告)日:1990-03-06
申请号:US56052
申请日:1987-06-01
CPC分类号: C08J5/18 , C08G73/1028 , C08J2379/08
摘要: Extraction of polyamic acid-polyimide gel in bipolymerized polyimide manufacturing process with a solvent containing an extraction-enhancing agent, which is a pyridine, picoline, or quinoline, leads to a polyimide film having increased molecular weight. Polyimides are valuable materials used in fabricating articles which must withstand high temperatures, especially in aerospace applications, and in the manufacture of electronic circuit boards.
摘要翻译: 使用含有萃取增强剂(其为吡啶,甲基吡啶或喹啉)的溶剂的聚合聚酰亚胺制造方法中的聚酰胺酸 - 聚酰亚胺凝胶的提取导致分子量增加的聚酰亚胺膜。 聚酰亚胺是用于制造制品的有价值的材料,其必须经受高温,特别是在航空航天应用中以及在电子电路板的制造中。
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公开(公告)号:US4358581A
公开(公告)日:1982-11-09
申请号:US213325
申请日:1980-12-05
CPC分类号: C08G73/1028
摘要: A process is disclosed for manufacturing high molecular weight polyimide from a chilled solution which includes a polyamide acid prepolymer, a finishing component, and a converting system wherein, when the solution is heated, polyamide acid polymer is formed and converted to polyimide.
摘要翻译: 公开了一种从包含聚酰胺酸预聚物,精加工组分和转化体系的冷冻溶液制造高分子量聚酰亚胺的方法,其中当加热溶液时,形成聚酰胺酸聚合物并转化成聚酰亚胺。
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公开(公告)号:US5166308A
公开(公告)日:1992-11-24
申请号:US516887
申请日:1990-04-30
CPC分类号: C08J5/18 , C08G73/1042 , C08G73/1071 , C08J2379/08 , H05K1/0346 , H05K2201/0154 , H05K3/022
摘要: Disclosed is an aromatic copolyimide film prepared by chemical conversion of a copolyamide acid solution obtained by copolymerization of an aromatic tetracarboxylic acid component comprising from 30 to 50 mole % of biphenyltetracarboxylic acid dianhydride, 50 to 70 mole % of pyromellitic acid dianhydride, 60 to 80 mole % of p-phenylenediamine and 20 to 40 mole % of 4,4'-diaminodiphenyl ether. The aromatic copolyimide film has a low coefficient of thermal expansion, low water absorption, a low coefficient of hygroscopic expansion, high mechanical strength and is readily etchable making it suitable for use an advanced electronic substrate.
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公开(公告)号:US4742153A
公开(公告)日:1988-05-03
申请号:US852688
申请日:1986-04-16
CPC分类号: C08G73/1014 , C08G73/1032 , C08G73/1057 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , H05K1/0346
摘要: An improved process for preparing polyimides is disclosed which involves end capping intermediate polyamic acids with dicarboxylic acid monoanhydrides and thermally converting to high molecular weight polyimides.
摘要翻译: 公开了改进的制备聚酰亚胺的方法,其涉及用二羧酸一酸酐封端中间体聚酰胺酸并热转化成高分子量聚酰亚胺。
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