公开(公告)号：US4239567A

公开(公告)日：1980-12-16

申请号：US951810

申请日：1978-10-16

申请人： Richard H. Winings

发明人： Richard H. Winings

IPC分类号： B24B37/30 ,  H01L21/302 ,  B32B31/00

CPC分类号： B24B37/30 ,  Y10S156/93 ,  Y10T156/1092 ,  Y10T156/11

摘要： PLanar articles such as silicon wafers 40 are removably mounted onto a flat microcellular polyurethane surface layer 48 of a carrier 30 to permit an exposed surface 42 of each wafer 40 to be polished.To retain the wafers 40 against lateral polishing forces on the carrier 30 the surface of the layer 48 is treated with a dilute organic acid prior to mounting the wafers 40. The treatment involves contacting the surface of the layer 48 with the acid selected from the group consisting of citric, propionic, formic and acetic acids. The surface of the layer 48 is thoroughly wetted with the acid after which all excess acid is scraped from the surface. The wafers 40 are then manually placed upon the surface while it is still wet.

摘要翻译： 诸如硅晶片40之类的平面物品可移除地安装在载体30的平坦的微孔聚氨酯表面层48上，以允许每个晶片40的暴露表面42被抛光。 为了保持晶片40抵抗载体30上的横向抛光力，在安装晶片40之前，用稀有机酸处理层48的表面。处理包括使层48的表面与选自下组的酸 由柠檬酸，丙酸，甲酸和乙酸组成。 层48的表面被酸彻底润湿，之后从表面刮下所有过量的酸。 然后将晶片40手动放置在表面上，同时它仍然是湿的。

公开(公告)号：US4077416A

公开(公告)日：1978-03-07

申请号：US679581

申请日：1976-04-23

申请人： Anderson F. Johnson, Jr. ,  Edward L. Stork ,  Richard H. Winings

发明人： Anderson F. Johnson, Jr. ,  Edward L. Stork ,  Richard H. Winings

IPC分类号： H01L21/306 ,  C23F1/08 ,  H01L21/00 ,  H01L21/02 ,  H01L21/673 ,  B08B3/04

CPC分类号： H01L21/6732 ,  C23F1/08 ,  H01L21/67086 ,  H01L21/67326 ,  Y10S134/902

摘要： To eliminate the manual handling of individual articles associated with loading and unloading conventional treating apparatus, a plurality of articles are simultaneously treated in the carriers which are used for batch handling prior to and subsequent to the treating operation. In a disclosed embodiment, wafer-shaped articles are held in mutually spaced substantially parallel relationship in a plurality of slots in a first carrier having an open face through which the wafers can be inserted and removed. The open face of the first carrier is abutted to the open face of an empty second carrier having at least a corresponding plurality of slots, such that the slots of the first carrier are aligned with the slots of the second carrier. The abutted carriers, with the wafers contained therein, are submersed in a treating medium and rotated about an axis running through the abutted faces of the carriers. The speed of rotation is maintained sufficient to produce rolling of the wafers through the axis, back and forth between the carriers.

摘要翻译： 为了消除与装卸常规处理装置相关的单个物品的手动处理，在处理操作之前和之后用于批处理的载体中同时处理多个制品。 在公开的实施例中，晶片状制品在具有开放面的第一载体中的多个槽中以相互间隔开的大致平行的关系保持，晶片可以通过该开口面被插入和移除。 第一载体的开口面抵靠具有至少相应多个槽的空第二载体的开口面，使得第一载体的槽与第二载体的槽对准。 其中容纳有晶片的邻接的载体浸没在处理介质中并围绕穿过载体的邻接面的轴线旋转。 旋转速度保持足以通过轴线在载体之间来回滚动晶片。

公开(公告)号：US3977926A

公开(公告)日：1976-08-31

申请号：US534918

申请日：1974-12-20

申请人： Anderson F. Johnson, Jr. ,  Edward L. Stork ,  Richard H. Winings

发明人： Anderson F. Johnson, Jr. ,  Edward L. Stork ,  Richard H. Winings

IPC分类号： H01L21/306 ,  C23F1/08 ,  H01L21/00 ,  H01L21/02 ,  H01L21/673

CPC分类号： H01L21/6732 ,  C23F1/08 ,  H01L21/67086 ,  H01L21/67326 ,  Y10S134/902

摘要： To eliminate the manual handling of individual articles associated with loading and unloading conventional treating apparatus, a plurality of articles are simultaneously treated in the carriers which are used for batch handling prior to and subsequent to the treating operation. In a disclosed embodiment, wafer-shaped articles are held in mutually spaced substantially parallel relationship in a plurality of slots in a first carrier having an open face through which the wafers can be inserted and removed. The open face of the first carrier is abutted to the open face of an empty second carrier having at least a corresponding plurality of slots, such that the slots of the first carrier are aligned with the slots of the second carrier. The abutted carriers, with the wafers contained therein, are submersed in a treating medium and rotated about an axis running through the abutted faces of the carriers. The speed of rotation is maintained sufficient to produce rolling of the wafers through the axis, back and forth between the carriers.

摘要翻译： 为了消除与装卸常规处理装置相关的单个物品的手动处理，在处理操作之前和之后用于批处理的载体中同时处理多个制品。 在公开的实施例中，晶片状制品在具有开放面的第一载体中的多个槽中以相互间隔开的大致平行的关系保持，晶片可以通过该开口面被插入和移除。 第一载体的开口面抵靠具有至少相应多个槽的空第二载体的开口面，使得第一载体的槽与第二载体的槽对准。 其中容纳有晶片的邻接的载体浸没在处理介质中并围绕穿过载体的邻接面的轴线旋转。 旋转速度保持足以通过轴线在载体之间来回滚动晶片。

公开(公告)号：US4049123A

公开(公告)日：1977-09-20

申请号：US691804

申请日：1976-06-01

申请人： Charles R. Fegley ,  Richard H. Winings ,  Clifford R. Yeich, Jr.

发明人： Charles R. Fegley ,  Richard H. Winings ,  Clifford R. Yeich, Jr.

IPC分类号： B07C5/08 ,  B07C5/344 ,  B07C5/36 ,  B65G47/34

CPC分类号： B07C5/083 ,  B07C5/344 ,  B07C5/36 ,  Y10S414/137

摘要： In making semiconductor devices such as integrated circuits, semiconductor wafers are often sorted according to both their thickness and their resistivity. To so sort the wafers they are moved successively along a first track to a thickness determining device which produces a signal indicative of the thickness of each wafer. This signal is stored by a computer. Continued successive movement of the wafers brings them to a resistivity determining device. This device, which is rendered effective by the stored thickness signal, produces a signal indicative of the resistivity of each wafer. The resistivity signal is stored by the computer. The successive movement of the wafers is continued along the first track to move them onto a second track. Each article is moved successively along the second track. And, in response to the stored signals, each article is moved into a preselected position associated with both the thickness and the resistivity of each article.

摘要翻译： 在制造诸如集成电路的半导体器件中，半导体晶片通常根据其厚度和电阻率进行分类。 为了对晶片进行分类，它们沿着第一轨道连续移动到厚度确定装置，其产生指示每个晶片的厚度的信号。 该信号由计算机存储。 晶片的连续运动使它们进入电阻率确定装置。 通过存储的厚度信号生效的该装置产生指示每个晶片的电阻率的信号。 电阻率信号由计算机存储。 晶片的连续移动沿着第一轨道继续移动到第二轨道上。 每个物品沿着第二个轨道连续移动。 并且，响应于所存储的信号，将每个物品移动到与每个物品的厚度和电阻率相关联的预选位置。