Method and a device for bonding two plate-shaped objects
    1.
    发明授权
    Method and a device for bonding two plate-shaped objects 有权
    方法和用于粘合两个板状物体的装置

    公开(公告)号:US07271075B2

    公开(公告)日:2007-09-18

    申请号:US10526191

    申请日:2003-08-04

    IPC分类号: H01L21/30

    CPC分类号: C09J5/06 C09J2400/143

    摘要: A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A moveable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the curve treatment.

    摘要翻译: 一种将两个板状物体(5)与通过紫外线照射和加热固化的粘合剂接合的方法。 具有粘合剂的两个板状物体(5)被输送到包括紫外灯(12)和加热元件(13)的固化室(11)中。 在照射处理的至少第一部分期间,可移动的热屏蔽构件(3)暂时存在于物体(5)和加热元件(13)之间。 优选地,在弯曲处理的一部分期间,热屏蔽构件(3)位于固化室(11)的外部。

    Device for bonding two plate-shaped objects
    2.
    发明授权
    Device for bonding two plate-shaped objects 有权
    用于粘接两个板状物体的装置

    公开(公告)号:US07845378B2

    公开(公告)日:2010-12-07

    申请号:US11773149

    申请日:2007-07-03

    IPC分类号: B29C65/02

    CPC分类号: C09J5/06 C09J2400/143

    摘要: A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A movable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the cure treatment.

    摘要翻译: 一种将两个板状物体(5)与通过紫外线照射和加热固化的粘合剂接合的方法。 具有粘合剂的两个板状物体(5)被输送到包括紫外灯(12)和加热元件(13)的固化室(11)中。 在照射处理的至少第一部分期间,可移动的热屏蔽构件(3)临时存在于物体(5)和加热元件(13)之间。 优选地,在固化处理的一部分期间,热屏蔽构件(3)位于固化室(11)的外部。