公开(公告)号：US20070185298A1

公开(公告)日：2007-08-09

申请号：US10549356

申请日：2004-03-31

Applicant: Kiran Baikerikar ,  Shaoguang Feng ,  Jack Hetzner ,  John Maher ,  Michael Mills ,  Paul Popa ,  Richard Strittmatter ,  Larry Wilson

Inventor： Kiran Baikerikar ,  Shaoguang Feng ,  Jack Hetzner ,  John Maher ,  Michael Mills ,  Paul Popa ,  Richard Strittmatter ,  Larry Wilson

IPC: C08G77/12

CPC classification number: C09D4/00 ,  C09D183/04 ,  G03F7/0045 ,  G03F7/0755 ,  G03F7/0757 ,  G03F7/091 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  C08G77/20

Abstract: A curable organosilicate composition that is employed to form one or more layers in the fabrication of electronic devices comprising: (a) an alkoxy or acyloxy silane having at least one group containing ethylenic unsaturation which group is bonded to the silicon atom (b) an alkoxy oracyloxy silane having at least one group containing an aromatic ring which group is bonded to the silicon atom, (c) a latent acid catalyst, and (d) optionally an alkoxy or acyloxy silane having at least one C1-C6 alkyl group bonded to the silicon atom.

Abstract translation: 一种用于在电子器件制造中形成一个或多个层的可固化的有机硅酸盐组合物，包括：（a）具有至少一个含有烯键不饱和基团的烷氧基或酰氧基硅烷，该基团与硅原子键合（b）烷氧基 具有至少一个含有该基团键合到硅原子上的芳环的芳基氧基硅烷，（c）一种潜在酸催化剂，和（d）任选具有至少一个C 1 N 2的烷氧基或酰氧基硅烷 键合到硅原子上的-C 6 -C 6烷基。