公开(公告)号：US5283107A

公开(公告)日：1994-02-01

申请号：US878098

申请日：1992-05-04

申请人： Thomas Bayer ,  Johann Greschner ,  Willy Hildenbrand ,  Bernd Marquart ,  Roland R. Stohr ,  Olaf Wolter

发明人： Thomas Bayer ,  Johann Greschner ,  Willy Hildenbrand ,  Bernd Marquart ,  Roland R. Stohr ,  Olaf Wolter

IPC分类号： H01L23/12 ,  H01L23/473 ,  H01L23/538 ,  H01L25/065 ,  H05K3/46 ,  B32B9/00

CPC分类号： H01L23/5383 ,  H01L23/473 ,  H01L23/5384 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A modular multilayer interwiring structure comprising a plurality of relatively small parts which are produced separately as `sub-units` (1). Each individual layer of the final structure is formed by joining a respective set of unit parts in one plane. The whole multilayer structure is then built by stacking these layers, preferably so that the units of one layer are not vertically aligned with the units of an adjacent layer. Each unit part includes at least one layer of conductive material (8, 9) on its front and/or rearside. These conductive layers may be individually patterned into diverse interconnection lines (5). Throughconnections (6) extending from the frontside to the backside of the units are provided using a desired set or a standardized array of via holes or openings filled with conductive material. By connecting desired throughconnections to the respective conduction lines, each unit may form an individual part of a more complex multilayer interwiring structure.

摘要翻译： 一种模块化多层互连结构，包括多个相对较小的部分，它们分别制造为“子单元”（1）。 最终结构的每个单独的层通过在一个平面中连接相应的单元部件组而形成。 然后通过堆叠这些层来构建整个多层结构，优选地使得一层的单元不与相邻层的单元垂直对准。 每个单元部分在其前部和/或后部包括至少一层导电材料（8,9）。 这些导电层可以单独地构图成不同的互连线（5）。 通过使用填充有导电材料的通孔或开口的期望的集合或标准化阵列来提供从单元的前侧延伸到后侧的直通连接（6）。 通过将期望的连接件连接到相应的导线，每个单元可以形成更复杂的多层互连结构的单独部分。