公开(公告)号：US20090205705A1

公开(公告)日：2009-08-20

申请号：US12225505

申请日：2007-03-20

申请人： Rolf Brendel ,  Barbara Terheiden ,  Andreas Wolf

发明人： Rolf Brendel ,  Barbara Terheiden ,  Andreas Wolf

IPC分类号： H01L31/04 ,  H01L21/20 ,  H01L29/36

CPC分类号： H01L31/1804 ,  H01L31/046 ,  H01L31/1892 ,  Y02E10/547 ,  Y02P70/521

摘要： The invention proposes a method for producing a semiconductor component, such as a thin-layer solar cell. The method involves providing a doped semiconductor carrier substrate (1), producing a separating layer (2), for example a porous layer, on one surface of the semiconductor carrier substrate, depositing a doped semiconductor layer (3) over the separating layer and detaching the deposited semiconductor layer from the semiconductor carrier substrate. In line with the invention, process parameters such as the process temperature and time are chosen during the manufacturing process such that dopants can diffuse from the separation layer into the deposited semiconductor layer in order to form a specifically doped surface area (4). Specific use of solid-state diffusion makes it possible to simplify the manufacturing process over conventional fabrication methods in this manner.

摘要翻译： 本发明提出一种半导体元件的制造方法，例如薄层太阳能电池。 该方法包括提供掺杂半导体载体衬底（1），在半导体载体衬底的一个表面上产生例如多孔层的分离层（2），在分离层上沉积掺杂的半导体层（3）和分离 来自半导体载体衬底的沉积的半导体层。 根据本发明，在制造过程中选择诸如工艺温度和时间的工艺参数，使得掺杂剂可以从分离层扩散到沉积的半导体层中，以便形成特别掺杂的表面区域（4）。 具体使用固态扩散使得可以以这种方式简化与常规制造方法相比的制造工艺。

公开(公告)号：US20140230878A1

公开(公告)日：2014-08-21

申请号：US14125869

申请日：2012-06-13

申请人： Henning Schulte-Huxel ,  Susanne Blankemeyer ,  Rolf Brendel ,  Robert Bock ,  Thorsten Dullweber ,  Nils-Peter Harder ,  Carsten Hampe ,  Yevgeniya Larionova

发明人： Henning Schulte-Huxel ,  Susanne Blankemeyer ,  Rolf Brendel ,  Robert Bock ,  Thorsten Dullweber ,  Nils-Peter Harder ,  Carsten Hampe ,  Yevgeniya Larionova

IPC分类号： H01L25/04 ,  H01L31/02

CPC分类号： H01L25/042 ,  H01L31/0445 ,  H01L31/0504 ,  H01L31/0516 ,  H01L31/188 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

摘要： The invention relates to a method for metallizing and connecting solar cell substrates and to a photovoltaic module made of several metallized solar cells that are electrically connected to one another. According to the invention, a solar cell substrate, in which second metal layers forming electrical metal contacts are optionally provided, is attached to a carrier substrate, on the surface of which at least one first metal layer is formed in a suitable pattern. By localized irradiation of the metal layer with laser radiation through the solar cell substrate or the carrier substrate, energy is introduced such that the metal layer is heated by absorbed laser radiation for an irreversible bonding to the adjacent surface of the solar cell substrate. By the laser bonding of the metal layer on the carrier substrate to the solar cell substrate, solar cells can be connected to form a photovoltaic module.

摘要翻译： 本发明涉及一种用于金属化和连接太阳能电池基板的方法以及由彼此电连接的几个金属化太阳能电池组成的光伏模块。 根据本发明，其中可选地提供形成电金属触点的第二金属层的太阳能电池基板被附接到载体基板，其表面上以适当的图案形成至少一个第一金属层。 通过通过太阳能电池基板或载体基板的激光辐射对金属层进行局部照射，引入能量，使得金属层被吸收的激光辐射加热，用于与太阳能电池基板的相邻表面的不可逆接合。 通过将载体基板上的金属层激光键合到太阳能电池基板，可以连接太阳能电池以形成光伏模块。

公开(公告)号：US20120282726A1

公开(公告)日：2012-11-08

申请号：US13509567

申请日：2010-11-11

申请人： Rolf Brendel ,  Marco Ernst

发明人： Rolf Brendel ,  Marco Ernst

IPC分类号： H01L31/18

CPC分类号： H01L31/0284 ,  H01L21/3063 ,  H01L31/1804 ,  H01L31/1896 ,  Y02E10/547 ,  Y02P70/521

摘要： Described is a method for forming thin semiconductor layer substrates for manufacturing solar cells, in which method in a provided semiconductor substrate alternately macroporous layers of low macroporosity and etched-away layers can be formed by electrochemical etching. The etched-away layers separate adjacent macroporous layers so that these are preferably self-supporting. In this arrangement an edge region of the semiconductor substrate, which edge region encompasses the macroporous layers at least in part, remains non-etched and is thus used for mechanically stabilizing the encompassed lightly-macroporous layers connected to it. The multilayer stack produced in this manner can subsequently, in a joint fluid process step, as an entity be subjected to further processing steps, for example can be coated with a passivating oxide. Subsequently, the macroporous layers can be separated, successively, from the stabilizing edge region of the semiconductor substrate, wherein a mechanical connection between the macroporous layer and the non-porous edge region is interrupted. Prior to tearing off the respective uppermost layer, processes that have a single-sided effect can be applied. In this way a multitude of thin semiconductor layer substrates in the form of macroporous layers including good surface passivation and a reflection-reducing surface texture can be produced with only a few process steps.

摘要翻译： 描述了一种用于形成用于制造太阳能电池的薄半导体层基板的方法，其中在所提供的半导体基板中的方法可以通过电化学蚀刻形成交替的大孔隙和蚀刻掉的大孔层。 蚀刻掉的层分隔相邻的大孔层，使得它们优选是自支撑的。 在这种布置中，半导体衬底的边缘区域至少部分地包围大孔层的边缘区域保持未蚀刻，因此用于机械地稳定与其连接的包围的轻微大孔层。 以这种方式生产的多层叠层随后可以在联合流体工艺步骤中作为实体进行进一步的加工步骤，例如可以用钝化氧化物涂覆。 随后，可以从半导体衬底的稳定边缘区域依次分离大孔层，其中大孔层和非多孔边缘区域之间的机械连接被中断。 在撕开相应的最上层之前，可以应用具有单面效应的工艺。 以这种方式，可以仅通过几个工艺步骤来制造大量层的形式的包括良好的表面钝化和减少反射的表面纹理的大量薄的半导体层衬底。

公开(公告)号：US06645833B2

公开(公告)日：2003-11-11

申请号：US09447000

申请日：2000-04-07

申请人： Rolf Brendel

发明人： Rolf Brendel

IPC分类号： H01L2130

CPC分类号： H01L31/1804 ,  H01L21/76259 ,  H01L31/02363 ,  H01L31/056 ,  H01L31/068 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521

摘要： The invention relates to a method of manufacturing layer-like structures in which a material layer having hollow cavities, preferably a porous material layer, is produced on or out of a substrate consisting, for example, of monocrystalline p-type or n-type Si and in which the layer-like structure, or a part of it, is subsequently provided on the cavity exhibiting or porous material layer. The layer-like structure, or a part of it, is subsequently separated from the substrate using the layer having the hollow cavities, or porous layer, as a point of desired separation, for example through the production of a mechanical strain within or at a boundary surface of the cavity exhibiting or porous layer. The method is characterized in that the surface of the substrate is structured prior to the production of the porous layer, or in that the surface of the porous layer is structured.

摘要翻译： 本发明涉及一种制造层状结构的方法，其中具有中空腔的材料层，优选多孔材料层，在例如单晶p型或n型Si 并且其中层状结构或其一部分随后设置在呈现或多孔材料层的空腔上。 随后，使用具有中空空腔或多孔层的层作为所需分离点，例如通过在内部或在其上产生机械应变将层状结构或其一部分与基底分离 空腔的边界表面或多孔层。 该方法的特征在于，在制造多孔层之前或者在多孔层的表面上构造衬底的表面。