Weak bond detection
    1.
    发明授权
    Weak bond detection 有权
    弱键检测

    公开(公告)号:US09488620B2

    公开(公告)日:2016-11-08

    申请号:US14004594

    申请日:2012-03-15

    摘要: Apparatuses and methods are disclosed for determining whether a structure of bonded layers includes locations where the layers are weakly bonded. Embodiments include evaluating the frequency response of the structure in response to vibrational inputs. Alternate embodiments include evaluating the non-linear response of the structure using a modal analysis. Further embodiments include obtaining the vibrational information with an accelerometer contacting the structure, while additional embodiments include exciting the structure with an impact force, which may be applied at multiple locations on the structure's surface. Still further embodiments include performing a MAC, COMAC, and/or FRF analysis. Still other embodiments include varying the amplitude of the input vibration. Additional embodiments locate the areas of weakened bonding. Still other embodiments include methods and apparatuses for simulating a laminated structure with defective bonding, such as kiss bonding.

    摘要翻译: 公开了用于确定接合层的结构是否包括层弱结合的位置的装置和方法。 实施例包括响应于振动输入来评估结构的频率响应。 替代实施例包括使用模态分析来评估结构的非线性响应。 另外的实施例包括使用接触该结构的加速度计获得振动信息,而另外的实施例包括使用冲击力激发该结构,该冲击力可以施加在结构表面上的多个位置处。 另外的实施例包括执行MAC,COMAC和/或FRF分析。 其它实施例包括改变输入振动的幅度。 另外的实施例定位弱化键合的区域。 其他实施例包括用于模拟具有缺陷接合的层压结构的方法和装置,例如亲吻。

    WEAK BOND DETECTION
    3.
    发明申请
    WEAK BOND DETECTION 有权
    弱绑定检测

    公开(公告)号:US20140047922A1

    公开(公告)日:2014-02-20

    申请号:US14004594

    申请日:2012-03-15

    IPC分类号: G01N29/11

    摘要: Apparatuses and methods are disclosed for determining whether a structure of bonded layers includes locations where the layers are weakly bonded. Embodiments include evaluating the frequency response of the structure in response to vibrational inputs. Alternate embodiments include evaluating the non-linear response of the structure using a modal analysis. Further embodiments include obtaining the vibrational information with an accelerometer contacting the structure, while additional embodiments include exciting the structure with an impact force, which may be applied at multiple locations on the structure's surface. Still further embodiments include performing a MAC, COMAC, and/or FRF analysis. Still other embodiments include varying the amplitude of the input vibration. Additional embodiments locate the areas of weakened bonding. Still other embodiments include methods and apparatuses for simulating a laminated structure with defective bonding, such as kiss bonding.

    摘要翻译: 公开了用于确定接合层的结构是否包括层弱结合的位置的装置和方法。 实施例包括响应于振动输入来评估结构的频率响应。 替代实施例包括使用模态分析来评估结构的非线性响应。 另外的实施例包括使用接触该结构的加速度计获得振动信息,而另外的实施例包括使用冲击力激发该结构,该冲击力可以施加在结构表面上的多个位置处。 另外的实施例包括执行MAC,COMAC和/或FRF分析。 其它实施例包括改变输入振动的幅度。 另外的实施例定位弱化键合的区域。 其他实施例包括用于模拟具有缺陷接合的层压结构的方法和装置,例如亲吻。