Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus
    1.
    发明申请
    Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus 有权
    复位基板处理装置的方法,实现该方法的存储介质存储程序和基板处理装置

    公开(公告)号:US20060100825A1

    公开(公告)日:2006-05-11

    申请号:US11270775

    申请日:2005-11-10

    IPC分类号: G06F11/30

    CPC分类号: H01L21/67288

    摘要: A method of resetting a substrate processing apparatus having a chamber which is capable of carrying out abnormality judgment on the substrate processing apparatus accurately without causing a decrease in the utilization ratio of the substrate processing apparatus. The chamber is evacuated. A temperature in the chamber is set. Whether or not there is an abnormality in the chamber is judged. An atmosphere in the chamber is stabilized so as to conform to predetermined processing conditions. At least one selected from data that change in response to a change in a state inside the chamber is measured. The measured data is compared with reference data that corresponds to the measured data for a normal state in the chamber.

    摘要翻译: 一种复位具有能够对基板处理装置进行异常判断的室的基板处理装置的复位方法,而不会导致基板处理装置的利用率的降低。 房间撤离。 设定室内的温度。 判断室内是否有异常。 室内的气氛稳定,以符合预定的加工条件。 测量根据室内状态的变化而变化的数据中选择的至少一种。 将测量数据与对应于室中正常状态的测量数据的参考数据进行比较。

    Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus
    2.
    发明授权
    Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus 有权
    复位基板处理装置的方法,实现该方法的存储介质存储程序和基板处理装置

    公开(公告)号:US07231321B2

    公开(公告)日:2007-06-12

    申请号:US11270775

    申请日:2005-11-10

    IPC分类号: G06F11/30 G21C17/00

    CPC分类号: H01L21/67288

    摘要: A method of resetting a substrate processing apparatus having a chamber which is capable of carrying out abnormality judgment on the substrate processing apparatus accurately without causing a decrease in the utilization ratio of the substrate processing apparatus. The chamber is evacuated. A temperature in the chamber is set. Whether or not there is an abnormality in the chamber is judged. An atmosphere in the chamber is stabilized so as to conform to predetermined processing conditions. At least one selected from data that change in response to a change in a state inside the chamber is measured. The measured data is compared with reference data that corresponds to the measured data for a normal state in the chamber.

    摘要翻译: 一种复位具有能够对基板处理装置进行异常判断的室的基板处理装置的复位方法,而不会导致基板处理装置的利用率的降低。 房间撤离。 设定室内的温度。 判断室内是否有异常。 室内的气氛稳定,以符合预定的加工条件。 测量根据室内状态的变化而变化的数据中选择的至少一种。 将测量数据与对应于室中正常状态的测量数据的参考数据进行比较。

    Dicing apparatus, kerf inspecting method and kerf inspecting system
    3.
    发明授权
    Dicing apparatus, kerf inspecting method and kerf inspecting system 失效
    切割装置,切片检查方法和切片检查系统

    公开(公告)号:US06422227B1

    公开(公告)日:2002-07-23

    申请号:US09704734

    申请日:2000-11-03

    IPC分类号: B28D104

    摘要: In a dicing apparatus that comprises a first blade and a second blade, the first blade cuts a wafer along a street along which the first blade has not previously cut the wafer, and the second blade cuts the wafer along a street along which the first blade has not cut the wafer, and then kerfs made by the blades are inspected. In this method, the kerfs are made along the different streets, and thus the kerfs made by the blades can be accurately inspected.

    摘要翻译: 在包括第一刀片和第二刀片的切割装置中,第一刀片沿着第一刀片先前未切割晶片的街道切割晶片,并且第二刀片沿着沿着第一刀片和第二刀片的街道切割晶片 没有切割晶片,然后检查由叶片制成的切口。 在这种方法中,沿着不同的街道形成切口,因此可以精确地检查由叶片制成的切口。