公开(公告)号：US20220068598A1

公开(公告)日：2022-03-03

申请号：US17417451

申请日：2019-12-26

申请人： SANYU ELECTRON CO., LTD. ,  KEIO UNIVERSITY

发明人： Shinsuke SHIBATA ,  Tomoko SHINDO ,  Hideyuki OKANO ,  Shuichi GOTO

IPC分类号： H01J37/28 ,  G01N1/28 ,  H01J37/32

摘要： Sample preparation system and method which enable electron microscope observation of a sample slice with simple structure and process are provided. The sample preparation system includes at least one of a plasma treatment apparatus and a sputtering apparatus, as well as a slice collecting apparatus. The plasma treatment apparatus is configured to feed a resin tape in a plasma irradiation area to irradiate the resin tape with plasma, thereby continuously hydrophilizing the resin tape. The sputtering apparatus is configured to feed the resin tape in a sputtering area to continuously perform sputtering on the resin tape, thereby imparting conductivity to the resin tape. The slice collecting apparatus is configured to serially collect slices cut out from a sample onto the resin tape having been subjected to plasma treatment or sputtering.

公开(公告)号：US11990314B2

公开(公告)日：2024-05-21

申请号：US17417451

申请日：2019-12-26

申请人： SANYU ELECTRON CO., LTD. ,  KEIO UNIVERSITY

发明人： Shinsuke Shibata ,  Tomoko Shindo ,  Hideyuki Okano ,  Shuichi Goto

IPC分类号： H01J37/28 ,  G01N1/28 ,  H01J37/32

CPC分类号： H01J37/28 ,  G01N1/28 ,  H01J37/32532 ,  H01J2237/2602 ,  H01J2237/2813

摘要： Sample preparation system and method which enable electron microscope observation of a sample slice with simple structure and process are provided. The sample preparation system includes at least one of a plasma treatment apparatus and a sputtering apparatus, as well as a slice collecting apparatus. The plasma treatment apparatus is configured to feed a resin tape in a plasma irradiation area to irradiate the resin tape with plasma, thereby continuously hydrophilizing the resin tape. The sputtering apparatus is configured to feed the resin tape in a sputtering area to continuously perform sputtering on the resin tape, thereby imparting conductivity to the resin tape. The slice collecting apparatus is configured to serially collect slices cut out from a sample onto the resin tape having been subjected to plasma treatment or sputtering.