公开(公告)号：US11613822B1

公开(公告)日：2023-03-28

申请号：US17696085

申请日：2022-03-16

Applicant: Shandong Shengquan New Materials Co., Ltd.

Inventor： Diyuan Tang ,  Weixin Liu ,  Qing Ma ,  Guobao Peng

IPC: C25B11/00 ,  C25C3/12

Abstract: The present application provides a resin carbon anode green body, and a resin carbon anode green body intermediate is obtained by hardening treatment of the resin carbon anode green body, and the resin carbon anode green body intermediate has the following spectral characteristics when tested by gas chromatography-mass spectrometry: there are characteristic peaks at the retention times of 4.95±0.3 min, 5.32±0.3 min, 5.47±0.3 min and 5.92±0.3 min. The present application also provides a method for preparing the resin carbon anode green body. In addition, the present application also provides a resin carbon anode green body intermediate, a resin carbon anode and the corresponding preparation methods and uses.

公开(公告)号：US20220373887A1

公开(公告)日：2022-11-24

申请号：US17624261

申请日：2019-07-02

Applicant: SHANDONG SHENGQUAN NEW MATERIALS CO LTD.

Inventor： Diyuan TANG ,  Zhifang LI ,  Ke BAI ,  Bin LIU ,  Chuanming SUN

IPC: G03F7/075 ,  G03F7/022

Abstract: An adhesion promoter as shown in Formula (I) and a photosensitive resin composition containing the adhesion promoter are disclosed: where R1, R2 and R3 each refer to a hydrogen atom, an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other optionally substituted carbon atom; A refers to an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other an optionally substituted carbon atom substituents; and the carbon in the alkyl, the alkenyl, the alkynyl, the phenyl, or the carbon atom substituents is optionally substituted with one or more of N, O and S; and X refers to an optionally substituted aromatic heterocyclic group. The adhesion promoter and the photosensitive resin composition can be used for manufacturing a semiconductor integrated circuit (IC), a LED and a flat-panel display.

公开(公告)号：US11886117B2

公开(公告)日：2024-01-30

申请号：US17624261

申请日：2019-07-02

Applicant: SHANDONG SHENGQUAN NEW MATERIALS CO LTD.

Inventor： Diyuan Tang ,  Zhifang Li ,  Ke Bai ,  Bin Liu ,  Chuanming Sun

IPC: G03F7/075 ,  G03F7/022

CPC classification number: G03F7/0751 ,  G03F7/0226 ,  G03F7/0755

Abstract: An adhesion promoter as shown in Formula (I) and a photosensitive resin composition containing the adhesion promoter are disclosed:






where R1, R2 and R3 each refer to a hydrogen atom, an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other optionally substituted carbon atom; A refers to an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other an optionally substituted carbon atom substituents; and the carbon in the alkyl, the alkenyl, the alkynyl, the phenyl, or the carbon atom substituents is optionally substituted with one or more of N, O and S; and X refers to an optionally substituted aromatic heterocyclic group. The adhesion promoter and the photosensitive resin composition can be used for manufacturing a semiconductor integrated circuit (IC), a LED and a flat-panel display.