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    CURED FILM AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
    3.
    发明申请
    CURED FILM AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：US20180356727A1

    公开(公告)日：2018-12-13

    申请号：US16075306

    申请日：2017-03-08

    申请人： TORAY INDUSTRIES, INC.

    发明人： Yuta SHUTO ,  Satoshi KAMEMOTO ,  Kazuto MIYOSHI

    IPC分类号： G03F7/022 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L27/32 ,  H01L23/498

    CPC分类号： G03F7/0226 ,  G03F7/004 ,  G03F7/023 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L23/49894 ,  H01L27/3258 ,  H01L51/50 ,  H05B33/10 ,  H05B33/22

    摘要： The invention provides a cured film and a positive type photosensitive resin composition unlikely to cause a decrease in light emission luminance or shrinkage of pixels and high in long term reliability.[Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less. The photosensitive resin composition comprises the alkali-soluble resin (a), photoacid generating agent (b), compound (c), thermal crosslinking agent (d), and an organic solvent (e), the compound (c) accounting for 0.1 part by mass or more and 15 parts by mass or less relative to 100 parts by mass of the alkali-soluble resin (a), and the organic solvent (e) accounting for 100 to 3,000 parts by mass relative thereto.

    Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same
    9.
    发明授权
    Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same 有权
    正型感光性树脂组合物，使用该固化膜的半导体装置的制造方法

    公开(公告)号：US09454078B2

    公开(公告)日：2016-09-27

    申请号：US14422664

    申请日：2013-09-11

    申请人： TORAY INDUSTRIES, INC.

    发明人： Hiroyuki Onishi ,  Yuki Masuda ,  Masao Tomikawa

    IPC分类号： G03F7/023 ,  G03F7/30 ,  G03F7/40 ,  C08G73/14 ,  C09D179/08 ,  C08G73/10 ,  G03F7/022

    CPC分类号： G03F7/0233 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1075 ,  C08G73/1082 ,  C08G73/14 ,  C09D179/08 ,  G03F7/0226 ,  G03F7/40 ,  C08K5/22 ,  C08K5/357

    摘要： The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

    摘要翻译： 本发明提供能够获得低翘曲的固化膜的正型感光性树脂组合物，在低温250℃以下的烧成时，高灵敏度，高分辨率也优异。 公开了一种正型感光性树脂组合物，其包含（a）包含由通式（1）表示的结构单元和由通式（2）表示的结构单元的聚酰亚胺树脂和（b）醌二叠氮化合物，其中 包含由通式（1）表示的结构单元和由通式（2）表示的结构单元的聚酰亚胺树脂的酰亚胺化率为85％以上，并且由通式 （1）表示的四羧酸残基在通式（2）表示的结构单元的范围为30:70〜90:10的范围内，通式（1）中的X1表示包含1〜4个芳环的四羧酸残基， Y1表示包含1〜4个芳香环的芳香族二胺残基，通式（2）中的X2表示包含1〜4个芳香环的四羧酸残基，Y2表示包含至少两个 或更多的主链中的亚烷基二醇单元。