公开(公告)号：US20240280766A1

公开(公告)日：2024-08-22

申请号：US18436086

申请日：2024-02-08

申请人： SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited

发明人： Mark Tieu Ming Seng

IPC分类号： G02B6/42

CPC分类号： G02B6/423 ,  G02B6/4268 ,  G02B6/4286

摘要： A 400G silicon photonic package with a self-aligned fiber includes a printed circuit board (PCB) base, a photonic integrated circuit (PIC) chip, a fiber array unit (FAU), and a distributed feedback (DFB) laser. The PIC chip is mounted on the PCB base; the DFB laser is provided on the PCB base and located outside the PIC chip; the FAU includes a fixed plate, a transmitting-terminal fiber, and a receiving-terminal fiber; V-shaped grooves are formed at a lower side of the fixed plate; the transmitting-terminal fiber and the receiving-terminal fiber are respectively arranged in the V-shaped grooves; the PIC chip is integrated with a photodiode (PD) and a monitor photo detector (MPD); V-shaped guide grooves are further formed in the PIC chip; the transmitting-terminal fiber and the receiving-terminal fiber are clamped between the V-shaped guide groove and the V-shaped groove.

公开(公告)号：US20240280771A1

公开(公告)日：2024-08-22

申请号：US18437258

申请日：2024-02-09

申请人： SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited

发明人： Jie Huang

IPC分类号： G02B6/42

CPC分类号： G02B6/4271 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4286

摘要： A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate includes: a housing, a printed circuit board (PCB) substrate, and a silicon photonic integrated circuit board, where an accommodating cavity is formed in the housing; the PCB substrate is provided in the accommodating cavity; a TEC substrate is embedded into the PCB substrate; the silicon photonic integrated circuit board is provided on the TEC substrate; the silicon photonic integrated circuit board is provided with an extended segment; the extended segment extends to one side and to the PCB substrate; a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board; the light emission assembly is mounted on the silicon photonic integrated circuit board; and the light emission assembly and the light-receiving detector are provided above the TEC substrate.

公开(公告)号：US20240280769A1

公开(公告)日：2024-08-22

申请号：US18437207

申请日：2024-02-08

申请人： SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited

发明人： Jie Huang

IPC分类号： G02B6/42

CPC分类号： G02B6/4246 ,  G02B6/4286

摘要： An 800G optical module with single-mode bidirectional fiber includes a housing and a printed circuit board (PCB) substrate, where two lenses are provided on the PCB substrate side by side; a filter and a beam splitter are provided in each of the lenses; a groove is formed at a bottom of the lens; the groove is covered by one light emission assembly and one light reception assembly, which are fixed on the PCB substrate; the lens is connected to a fiber array; two fiber arrays are connected to one optical connector; a connecting fiber between the fiber array and the optical connector is a single-mode bidirectional fiber; light emitted from the light emission assembly is transmitted to the optical connector, the beam splitter, the filter and the fiber array; and light received by the fiber array is transmitted to the light reception assembly.

公开(公告)号：US20240280768A1

公开(公告)日：2024-08-22

申请号：US18437260

申请日：2024-02-09

申请人： SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited

发明人： Jie Huang

IPC分类号： G02B6/42

CPC分类号： G02B6/4244 ,  G02B6/4214 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4295

摘要： A 400G silicon photonic integrated optical module with a photoelectric integrated substrate includes a printed circuit board (PCB) substrate, a fiber array, a detector assembly, and a laser assembly, where the fiber array, the detector assembly and the laser assembly are mounted on a surface of the PCB substrate; a recessed groove is formed in the surface of the PCB substrate; a silicon substrate is attached in the recessed groove; optical waveguides are arranged in the silicon substrate in parallel; a surface circuit board is further mounted at an upper side of the silicon substrate; a first microlens and a second microlens are further provided in the recessed groove; and an optical transmission path is formed between a fiber port of the fiber array, the first microlens, the optical waveguide, the second microlens, and the detector assembly or the laser assembly.