公开(公告)号：US06759018B1

公开(公告)日：2004-07-06

申请号：US09212107

申请日：1998-12-15

Applicant: Jose I. Arno ,  Mark Holst ,  Sam Yee ,  Joseph D. Sweeney ,  Jeff Lorelli ,  Jason Deseve

Inventor： Jose I. Arno ,  Mark Holst ,  Sam Yee ,  Joseph D. Sweeney ,  Jeff Lorelli ,  Jason Deseve

IPC: B01J804

CPC classification number: C30B25/14 ,  B01D19/04 ,  B01D45/00 ,  B01D53/68 ,  B01D53/70 ,  B01D53/78 ,  B01D2257/553 ,  B01D2258/0216 ,  B01J4/001 ,  B01J4/04 ,  B01J8/003 ,  B01J8/20 ,  B01J8/22 ,  B01J19/002 ,  B01J19/26 ,  B01J2219/00065 ,  B01J2219/00094 ,  B01J2219/00135 ,  B01J2219/00164 ,  B01J2219/00252 ,  B01J2219/00268 ,  C23C16/4412 ,  Y02C20/30

Abstract: A system for abating undesired component(s) from a gas stream containing same, such as halocompounds, acid gases, silanes, ammonia, etc., by scrubbing of the effluent gas stream with an aqueous scrubbing medium. Halocompounds, such as fluorine, fluorides, perfluorocarbons, and chlorofluorocarbons, may be scrubbed in the presence of a reducing agent, e.g., sodium thiosulfate, ammonium hydroxide, or potassium iodide. In one embodiment, the scrubbing system includes a first acid gas scrubbing unit operated in cocurrent gas/liquid flow, and a second “polishing” unit operated in countercurrent gas/liquid flow, to achieve high removal efficiency with low consumption of water. The scrubbing system may utilize removable insert beds of packing material, packaged in a foraminous containment structure. The abatement system of the invention has particular utility in the treatment of semiconductor manufacturing process effluents.

Abstract translation: 通过用含水洗涤介质洗涤流出物气流，从含有其的气流中消除不需要的组分的系统，例如卤化合物，酸性气体，硅烷，氨等。 可以在还原剂例如硫代硫酸钠，氢氧化铵或碘化钾的存在下洗涤Halocompounds，如氟，氟化物，全氟化碳和氯氟烃。 在一个实施例中，洗涤系统包括以并流气体/液体流动操作的第一酸性气体洗涤单元和以逆流气体/液体流动操作的第二“抛光”单元，以在低水消耗下实现高的去除效率。 洗涤系统可以利用可拆卸的包装材料的插入层，包装在有孔的容纳结构中。 本发明的减排系统在半导体制造工艺流出物的处理中具有特殊的用途。