Direct adhesive process
    2.
    发明授权
    Direct adhesive process 失效
    直接粘合工艺

    公开(公告)号:US5954909A

    公开(公告)日:1999-09-21

    申请号:US808388

    申请日:1997-02-28

    IPC分类号: H01F41/12 B32B31/00

    CPC分类号: H01F41/12

    摘要: Process of adhering conductors such as bare copper wire, copper wire with polymide insulation, and multistrand Kapton wrapped superconductors to mount structures such as a cylinder of arbitrary cross sections, a saddle support, or steel tubes using adhesive layers of material such as BONDALL 16-H, 3M-2090 and T-164. The adhesive layers are subject to b-staging before being used, where it is heated to a temperature of approximately 60-100.degree. C. for approximately 1/2 hour to approximately one hour. The support surface can optionally be grooved to allow for better wire placement and no wire slippage.

    摘要翻译: 粘接诸如裸铜线,具有聚酰亚胺绝缘体的铜线和多股卡普顿包覆超导体等导体的工艺可以安装任意横截面的圆柱体,鞍形支架或使用诸如BONDALL 16- H,3M-2090和T-164。 粘合剂层在使用之前经历b阶段,其中将其加热至约60-100℃的温度约+ E,从1/2 + EE小时至约1小时。 支撑表面可以可选地被开槽,以允许更好的导线放置和没有线滑动。