-
公开(公告)号：US08680880B2
公开(公告)日：2014-03-25
申请号：US12637656
申请日：2009-12-14
IPC分类号： G01R31/20
CPC分类号： G01R31/2875
摘要： An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.
摘要翻译： 用于测试集成电路的方法的一个实施例包括第一步骤，用于确定选自接收集成电路的卡盘顶部是否存在于探针卡附近的组中的至少一个，所述探针卡向集成电路发送和接收电信号 电路，集成电路是否在测试中，以及探针卡是否具有给定的温度，以及第二步骤，用于根据确定结果调节供应到设置在探针卡中的加热元件的加热功率 在第一步。
-
公开(公告)号：US20100164520A1
公开(公告)日：2010-07-01
申请号：US12637656
申请日：2009-12-14
CPC分类号： G01R31/2875
摘要： An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.
摘要翻译： 用于测试集成电路的方法的一个实施例包括第一步骤，用于确定选自接收集成电路的卡盘顶部是否存在于探针卡附近的组中的至少一个，所述探针卡向集成电路发送和接收电信号 电路，集成电路是否在测试中，以及探针卡是否具有给定的温度，以及第二步骤，用于根据确定结果调节供应到设置在探针卡中的加热元件的加热功率 在第一步。
-
搜索结果
2 条记录 (耗时 0.011 秒)
