Abstract:
A system is disclosed for calibrating the compressive forces exerted on a component during a component retrieval process from a carrier or support surface by a component handling device. The system includes a sensor, a component pickup assembly having a reference structure, a housing and a spring guide holder coupled to a suction tip. A resilient member may reside within the housing and the reference structure such that the spring guide holder and the housing are spaced from each other to define a variable first gap thereinbetween. A gate is formed by the reference structure and a sheath located on the housing whereby the reference structure is spaced from the housing to define a variable second gap thereinbetween. A detection structure is located within the variable second gap such that the sensor is able to detect portions of the detection structure. The detected portion of the detection structure or element at the second gap size is correlated to the height of the variable first gap and the height of the variable first gap is correlated to a reference predetermined threshold compressive force exerted on the component by the resilient member.
Abstract:
A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection. Sidewall illuminators and sidewall beam splitters can form portions of a five sided inspection apparatus that includes a brightfield illuminator, a darkfield illuminator, and an image capture beam splitter such that the five sided inspection apparatus is configurable for inspecting component bottom surfaces and/or component sidewalls in a selective/selectable manner.
Abstract:
A system is disclosed for calibrating the compressive forces exerted on a component during a component retrieval process from a carrier or support surface by a component handling device. The system includes a sensor, a component pickup assembly having a reference structure, a housing and a spring guide holder coupled to a suction tip. A resilient member may reside within the housing and the reference structure such that the spring guide holder and the housing are spaced from each other to define a variable first gap thereinbetween. A gate is formed by the reference structure and a sheath located on the housing whereby the reference structure is spaced from the housing to define a variable second gap thereinbetween. A detection structure is located within the variable second gap such that the sensor is able to detect portions of the detection structure. The detected portion of the detection structure or element at the second gap size is correlated to the height of the variable first gap and the height of the variable first gap is correlated to a reference predetermined threshold compressive force exerted on the component by the resilient member.
Abstract:
A component inspection process includes positioning a component (e.g., a semiconductor component or other object) such that component sidewalls are disposed along an optical path corresponding to sidewall beam splitters configured for receiving sidewall illumination provided by a set of sidewall illuminators, and transmitting this sidewall illumination therethrough, toward and to component sidewalls. Sidewall illumination incident upon component sidewalls is reflected from the component sidewalls back toward the sidewall beam splitters, which reflect or redirect this reflected sidewall illumination along an optical path corresponding to an image capture device for sidewall image capture to enable component sidewall inspection. Sidewall illuminators and sidewall beam splitters can form portions of a five sided inspection apparatus that includes a brightfield illuminator, a darkfield illuminator, and an image capture beam splitter such that the five sided inspection apparatus is configurable for inspecting component bottom surfaces and/or component sidewalls in a selective/selectable manner.