公开(公告)号：US20090139754A1

公开(公告)日：2009-06-04

申请号：US12086622

申请日：2006-12-21

申请人： Senichi Ikarashi ,  Kiminori Yokoyama

发明人： Senichi Ikarashi ,  Kiminori Yokoyama

IPC分类号： H01B1/02 ,  H05K1/09

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30

摘要： Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ. A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700° C. or higher; (B) metal powder having a melting point of higher than 300 to lower than 700° C.; and (C) a thermosetting resin.

摘要翻译： 公开了一种热固性导电浆料，其优点在于，使用该糊料形成的多层陶瓷电子部件的外部电极与内部电极具有优异的接合性，并且适合于安装在基板或电镀上，实现优异的电性能（静电电容， tanδ。一种热固性导电糊剂，其包含：（A）熔点为700℃以上的金属粉末;（B）熔点高于300℃且低于700℃的金属粉末;和（C ）热固性树脂。

公开(公告)号：US08168889B2

公开(公告)日：2012-05-01

申请号：US12086622

申请日：2006-12-21

申请人： Senichi Ikarashi ,  Kiminori Yokoyama

发明人： Senichi Ikarashi ,  Kiminori Yokoyama

IPC分类号： H05K1/09 ,  H01G4/228

CPC分类号： H01G4/2325 ,  H01B1/22 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30

摘要： Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ. A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700° C. or higher; (B) metal powder having a melting point of higher than 300 to lower than 700° C.; and (C) a thermosetting resin.

摘要翻译： 公开了一种热固性导电浆料，其优点在于，使用该糊料形成的多层陶瓷电子部件的外部电极与内部电极具有优异的接合性，并且适合于安装在基板或电镀上，实现优异的电性能（静电电容， tanδ。一种热固性导电膏，其包含：（A）熔点为700℃以上的金属粉末;（B）熔点高于300℃且低于700℃的金属粉末;和（C ）热固性树脂。