公开(公告)号：US20240212892A1

公开(公告)日：2024-06-27

申请号：US18487058

申请日：2023-10-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUTO AKIYAMA ,  YASUTAKA HANASHIRO ,  KEIJI KAWAJIRI

IPC: H01C7/10 ,  H01C7/00 ,  H01C7/18 ,  H01G4/008 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01C7/10 ,  H01C7/008 ,  H01C7/18 ,  H01G4/008 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

Abstract: A laminated ceramic component includes a sintered body, internal electrodes provided inside the sintered body, and external electrodes provided on a surface of the sintered body and electrically connected to the internal electrodes. The external electrodes include a first end-surface electrode provided on at least a portion of a first end surface of the sintered body, a second end-surface electrode provided on at least a portion of a second end surface of the sintered body, a first side-surface electrode provided on a portion of a first side surface of the sintered body, and a second side-surface electrode provided on a portion of a second side surface of the sintered body. Each of the first and second end-surface electrodes and the first and second side-surface electrodes contains metal and glass component. A content of the glass component in each of the first and second end-surface electrodes is different from a content of the glass component in each of the first and second side-surface electrodes.

公开(公告)号：US20240029925A1

公开(公告)日：2024-01-25

申请号：US18482101

申请日：2023-10-06

Applicant: ROHM CO., LTD.

Inventor： Kosaku TANAKA

IPC: H01C1/148 ,  H01C1/032 ,  H01C7/18

CPC classification number: H01C1/148 ,  H01C1/032 ,  H01C7/18

Abstract: A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.

公开(公告)号：US20230368949A1

公开(公告)日：2023-11-16

申请号：US18248190

申请日：2021-09-22

Applicant: ROHM CO., LTD.

Inventor： Takuya MAEKAWA

IPC: H01C1/032 ,  H01C1/148 ,  H01C7/18 ,  H01C7/00

CPC classification number: H01C1/032 ,  H01C1/148 ,  H01C7/18 ,  H01C7/006

Abstract: A chip resistor includes a substrate, a first electrode, a second electrode, a first resistor body, a second resistor body, and a connection electrode. The substrate includes a first primary surface. The first electrode includes a first terminal electrode and a first auxiliary electrode. The second electrode includes a second terminal electrode and a second auxiliary electrode. The first auxiliary electrode has a larger area than the first terminal electrode and the second auxiliary electrode has a larger area than the second terminal electrode, in plan view of the first primary surface of the substrate.

公开(公告)号：US20230317372A1

公开(公告)日：2023-10-05

申请号：US18124015

申请日：2023-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukie WATANABE

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01C7/00 ,  H01C7/18 ,  H01C1/148

CPC classification number: H01G4/005 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01C7/008 ,  H01C7/18 ,  H01C1/148

Abstract: In a multilayer ceramic electronic component, a first auxiliary electrode layer spaced away from a second internal electrode layer and exposed to a first end surface is on a same plane as a ceramic layer on which the second internal electrode layer is located, a second auxiliary electrode layer spaced away from a first internal electrode layer and exposed to a second end surface is on a same plane as the ceramic layer on which the first internal electrode layer is located, a first via conductor is at a central portion in a width direction of the first internal electrode layer and the first auxiliary electrode layer and exposed to the first end surface, and a second via conductor is at a central portion in a width direction of the second internal electrode layer and the second auxiliary electrode layer and exposed to the second end surface.

公开(公告)号：US20230274864A1

公开(公告)日：2023-08-31

申请号：US18173598

申请日：2023-02-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuto AKIYAMA ,  Ken YANAI ,  Masashi TAKAMURA ,  Yuji YAMAGISHI ,  Ryosuke USUI

IPC: H01C7/102 ,  H01C7/18

CPC classification number: H01C7/102 ,  H01C7/18

Abstract: A multilayer varistor according to the present disclosure includes: a sintered compact having, on a surface thereof, at least one planar portion and at least one corner portion; an internal electrode provided inside the sintered compact; a high-resistivity layer arranged to cover the at least one planar portion and the at least one corner portion of the sintered compact at least partially; and an external electrode arranged to cover the high-resistivity layer partially and electrically connected to the internal electrode. The high-resistivity layer includes: a first high-resistivity layer covering the at least one planar portion; and a second high-resistivity layer covering the at least one corner portion. The first high-resistivity layer has a larger average thickness than the second high-resistivity layer.

公开(公告)号：US10074465B2

公开(公告)日：2018-09-11

申请号：US15611826

申请日：2017-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichi Hirata ,  Noboru Furukawa ,  Yasuo Sasaki ,  Kiyohiro Koto ,  Kojiro Tokieda ,  Yukiko Ueda

IPC: H01C7/10 ,  H01C7/04 ,  H01C17/245 ,  H01C1/142 ,  H01C17/28

CPC classification number: H01C7/041 ,  H01C1/142 ,  H01C1/148 ,  H01C7/18 ,  H01C17/245 ,  H01C17/281

Abstract: A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.

公开(公告)号：US10062512B2

公开(公告)日：2018-08-28

申请号：US15488562

申请日：2017-04-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuharu Yamashita

IPC: H01G4/232 ,  H01G4/30 ,  H01F27/28 ,  H01C7/00 ,  H01F27/29 ,  H01G4/12 ,  H01F17/00

CPC classification number: H01G4/2325 ,  H01C1/148 ,  H01C7/008 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/1218 ,  H01G4/30

Abstract: A multilayer ceramic electronic component has a dimension in a longitudinal direction of no less than about 0.12 mm and no more than about 0.27 mm, a dimension in a width direction of no less than about 0.06 mm and no more than about 0.14 mm, and a dimension in a lamination direction of no less than about 0.06 mm and no more than about 0.14 mm, for example. Each of a first outer electrode and a second outer electrode includes an underlying electrode layer disposed on a surface of a multilayer body, a nickel-plated layer covering the underlying electrode layer, and a tin-plated layer covering the nickel-plated layer. The nickel-plated layer in each of the first outer electrode and second outer electrode has surface roughness of no less than about 3 μm and no more than about 6 μm, for example.

公开(公告)号：US20170316853A1

公开(公告)日：2017-11-02

申请号：US15523019

申请日：2015-08-25

Applicant: KOA Corporation

Inventor： Kentaro MATSUMOTO

IPC: H01C1/142 ,  H01C17/242 ,  H01C17/00 ,  H01C17/28 ,  H01C1/012

CPC classification number: H01C1/142 ,  H01C1/012 ,  H01C1/032 ,  H01C1/148 ,  H01C7/18 ,  H01C17/006 ,  H01C17/242 ,  H01C17/281

Abstract: To provide a chip resistor in which a resistive element can be surely protected from an external environment and which is also excellent in corrosion resistance, a chip resistor 1 is configured to include an insulating substrate 2, a pair of front electrode 3 provided on opposite end portions of a front surface of the insulating substrate 2, a pair of back electrodes 7 provided on opposite end portions of a back surface of the insulating substrate 2, a resistive element 4 provided to extend onto the two front electrodes 3, a first insulating layer 5 covering the resistive element 4, a second insulating layer 6 made of a resin material to cover the first insulating layer 5, end surface electrodes 8 establishing electrical continuity between the front electrodes 3 and the back electrodes 7, plating layers 9 covering the end surface electrodes 8, etc. Rough surface portions 6a made rougher in surface roughness than any other portion of the second insulating layer 6 are formed at opposite end portions of the second insulating layer 6. End portions of the end surface electrodes 8 and the plating layers 9 are brought into tight contact with the rough surface portions 6a respectively.

公开(公告)号：US20170278626A1

公开(公告)日：2017-09-28

申请号：US15274550

申请日：2016-09-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM

IPC: H01F27/40 ,  H01G4/248 ,  H01C1/148 ,  H01F27/29 ,  H01C7/00 ,  H01G4/005 ,  H01F27/28

CPC classification number: H01F27/402 ,  H01C1/06 ,  H01C1/148 ,  H01C7/008 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01G2/14 ,  H01G4/248 ,  H01G4/30

Abstract: A composite electronic component includes a body having first and second external electrodes disposed on outer surfaces thereof and including a dielectric body; first and second electrodes disposed in the dielectric body and electrically connected to the first and second external electrodes, respectively; a third electrode disposed on the body and electrically connected to the first external electrode; an electrostatic discharge (ESD) layer disposed on the third electrode; and a fourth electrode disposed on the ESD discharge layer and electrically connected to the second external electrode.

公开(公告)号：US20170092556A1

公开(公告)日：2017-03-30

申请号：US15376729

申请日：2016-12-13

Applicant: VQ RESEARCH, INC.

Inventor： John L. Gustafson

IPC: H01L23/055 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H01G4/30 ,  H05K3/12 ,  H05K3/22 ,  G06F17/50 ,  H01F27/28 ,  H01F27/24 ,  H01C7/18 ,  H01L23/15 ,  H01L23/60

CPC classification number: H01L23/055 ,  G06F17/5072 ,  G06F17/5081 ,  H01C7/18 ,  H01F27/24 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H01L21/4807 ,  H01L21/4846 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/1283 ,  H05K3/227 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.