摘要:
An array for a display device is formed by adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate. The supporting film is then released from the photoresist resin layer adhered to the surface of the substrate, the layer is exposed to light; and the positive type photoresist layer is developed to remove exposed regions.
摘要:
Disclosed are a composition for positive type photoresist and a positive type photoresist film manufactured thereby. The composition comprises an alkali soluble resin, a photosensitive compound, a thermo-curable cross linking agent, a sensitivity enhancer and a solvent. The photoresist film has a supporting film and a photoresist layer formed on the supporting film, wherein the photoresist layer comprises the alkali soluble resin, the photosensitive compound, the thermo-curable cross linking agent and the sensitivity enhancer.
摘要:
Disclosed are a composition for positive type photoresist and a positive type photoresist film manufactured thereby. The composition comprises an alkali soluble resin, a photosensitive compound, a thermo-curable cross linking agent, a sensitivity enhancer and a solvent. The photoresist film has a supporting film and a photoresist layer formed on the supporting film, wherein the photoresist layer comprises the alkali soluble resin, the photosensitive compound, the thermo-curable cross linking agent and the sensitivity enhancer.
摘要:
A positive type photoresist resin film contains a support film and a positive photoresist resin layer laminated over the support film. The photoresist layer may be formed from a composition containing a resin, a photosensitive compound, and a first solvent having a boiling point sufficiently high such that a second solvent can be removed from the composition by heating while the first solvent is substantially retained in the composition.
摘要:
An array for a display device is formed by adhering a positive dry film resist, which has a positive photoresist resin layer over a supporting film, to a substrate such that the photoresist resin layer adheres on a surface of the substrate. The supporting film is then released from the photoresist resin layer adhered to the surface of the substrate, the layer is exposed to light; and the positive type photoresist layer is developed to remove exposed regions.