公开(公告)号：US20130008938A1

公开(公告)日：2013-01-10

申请号：US13234935

申请日：2011-09-16

Applicant: Je Kyoung KIM ,  Seong Hoon BAE ,  Young Kwan LEE ,  Su Jin LEE

Inventor： Je Kyoung KIM ,  Seong Hoon BAE ,  Young Kwan LEE ,  Su Jin LEE

IPC: B23K1/20 ,  B23K31/02

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K2101/42

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.

Abstract translation: 本发明公开了印刷电路板的制造方法，该方法包括：准备具有连接垫的基底基板; 在连接垫上形成表面处理层; 对具有形成表面处理层的连接焊盘的基底基板进行制冷处理; 以及在所述冷冻处理过的基底基板的连接垫上印刷焊膏。