Abstract:
An OLED display includes: a substrate; an organic light emitting element formed on the substrate and including a first electrode, an emission layer, and a second electrode; and an encapsulation layer formed on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer, and a protrusion and depression structure is formed in an interface between the organic layer and the inorganic layer.
Abstract:
Provided are display panel, method of manufacturing the same, and frit composition used in the display panel. A display panel comprising: a first substrate, a second substrate facing the first substrate and a frit bonding the first substrate and the second substrate together, wherein the frit has an optical density of more than about 0.0683/μm for laser light of any one wavelength in a wavelength range of about 760 to about 860 nm.
Abstract:
An organic light emitting diode (OLED) display a includes: a substrate; an organic light emitting element on the substrate and including a first electrode, a light emission layer, and a second electrode; and an encapsulation layer on the substrate while covering the organic light emitting element. The encapsulation layer includes an organic layer and an inorganic layer. A mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer.
Abstract:
Discloses is an organic light emitting display device including a first substrate divided into a pixel region and a non-pixel region. An organic light emitting element includes a first electrode, an organic thin film layer and a second electrode formed in the pixel region. A scan driver and a metal film corresponding to a region of the scan driver are formed in the non-pixel region. A second substrate is spaced apart from the pixel region and the non-pixel region of the first substrate. A frit is formed along an edge of a non-pixel region of the second substrate, wherein the frit is formed so that it can be overlapped with an active area of the scan driver formed in the non-pixel region.
Abstract:
In an organic light emitting display apparatus and a method of manufacturing the same, the organic light emitting display apparatus comprises: a first substrate, one surface of which is divided into a non-display area and a display area including an organic light emitting diode (OLED); a second substrate, one surface of which faces the one surface of the first substrate; and a bonding member disposed between the first and second substrates so as to surround the display area of the first substrate, and bonding the first and second substrates to each other to define an inner portion including the display area and an outer portion including the non-display area. A bonding portion formed by the bonding member includes an effective bonding portion and a non-effective bonding portion. The non-effective bonding portion includes an inner non-effective bonding portion contacting one side of the effective bonding portion and disposed adjacent to the inner portion, and an outer non-effective bonding portion contacting another side of the effective bonding portion and disposed adjacent to the outer portion by interposing the effective bonding portion between the inner and outer non-effective bonding portions.
Abstract:
An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a display substrate, ii) an OLED array, iii) an encapsulation substrate arranged opposite to the display substrate with respect to the OLED array, iv) a sealing member configured to seal the display substrate and the encapsulation substrate and v) a filler applied in a space formed between the display substrate and the encapsulation substrate. In one embodiment, the height of the filler is more than about 1.2 times the height of the OLED array.
Abstract:
An organic light emitting display device includes a first substrate including a pixel region in which at least one organic light emitting diode including a first electrode, an organic layer, and a second electrode is formed and a non-pixel region formed beside the pixel region. The device includes a second substrate and a frit provided between the non-pixel region on the first substrate and the second substrate. A reflection prevention layer is formed on at least one surface of the second substrate.
Abstract:
An organic light emitting display device includes a first substrate including a pixel region in which at least one organic light emitting diode including a first electrode, an organic layer, and a second electrode is formed and a non-pixel region formed beside the pixel region. The device includes a second substrate and a frit provided between the non-pixel region on the first substrate and the second substrate. A reflection prevention layer is formed on at least one surface of the second substrate.
Abstract:
An organic light-emitting display apparatus for selectively realizing circular polarization according to external light conditions, including a substrate; an organic light-emitting device on the substrate; a sealing member on the organic light-emitting device; a phase retardation layer on a surface of the substrate, the organic light-emitting device, or the sealing member; and a linear polarization layer on another surface of the substrate, the organic light-emitting device, or the sealing member, wherein the linear polarization layer is located to be closer to a source of external light than the phase retardation layer, and wherein the linear polarization layer comprises a photochromic material.
Abstract:
An organic light emitting diode (OLED) display device and method of fabrication that includes a substrate having a device region, an outer dam region and an encapsulation region. The encapsulation region includes an inner dam region, an outer dam region and an encapsulation region that correspond to the device region. An encapsulation agent is formed in the encapsulation region of the encapsulation substrate, and filling dams are formed of the same material in the outer dam region and the inner dam region of the encapsulation substrate.