公开(公告)号：US06215536B1

公开(公告)日：2001-04-10

申请号：US09227051

申请日：1999-01-07

申请人： Teruo Ebihara ,  Shunichi Motte ,  Kaori Takano ,  Shigeru Sembonmatsu ,  Hiroshi Sakuma ,  Takakazu Fukuchi ,  Osamu Yamazaki ,  Masafumi Hoshino ,  Naotoshi Shino ,  Shuhei Yamamoto ,  Masanori Fujita

发明人： Teruo Ebihara ,  Shunichi Motte ,  Kaori Takano ,  Shigeru Sembonmatsu ,  Hiroshi Sakuma ,  Takakazu Fukuchi ,  Osamu Yamazaki ,  Masafumi Hoshino ,  Naotoshi Shino ,  Shuhei Yamamoto ,  Masanori Fujita

IPC分类号： G02F11333

CPC分类号： G02F1/133514 ,  G02F1/1334 ,  G02F2203/02

摘要： A reflective liquid crystal display device comprises a transparent first substrate having formed thereon a transparent electrode, a first filter having a first color, and a second filte having a second color. A second substrate is disposed opposite and spaced-apart from the first substrate. A reflection layer is disposed on the second substrate. A polymer dispersed liquid crystal layer is disposed between the transparent electrode and the reflection layer and is formed by exposure to an ultraviolet ray in a preselected wavelength range. A ratio of a transmissivity of the first filter for the ultraviolet ray to a transmissivity of the second filter for the ultraviolet ray is 3.0 or less.

摘要翻译： 反射型液晶显示装置包括其上形成有透明电极的透明第一基板，具有第一颜色的第一滤光器和具有第二颜色的第二滤光片。 第二基板设置成与第一基板相对且间隔开。 反射层设置在第二基板上。 聚合物分散液晶层设置在透明电极和反射层之间，并且通过以预选的波长范围暴露于紫外线而形成。 用于紫外线的第一滤光器的透射率与第二紫外线滤光器的透射率之比为3.0以下。

公开(公告)号：US06357595B2

公开(公告)日：2002-03-19

申请号：US09559348

申请日：2000-04-27

申请人： Shigeru Sembonmatsu ,  Manabu Ishikawa

发明人： Shigeru Sembonmatsu ,  Manabu Ishikawa

IPC分类号： B65D8500

CPC分类号： H01L21/67333 ,  H01L2221/68313

摘要： A tray for storing a semiconductor device such as a BGA device. This tray comprises a storage portion for receiving and storing the BGA device therein. The storage portion has a wall surface which is arranged around the semiconductor device upon storing the semiconductor device. This wall surface has an area which is inclined with an angle so as to support an edge of a package of the semiconductor device but not to come into contact with wiring terminals thereof. With this arrangement, the inclined are comes into contact with only the edge of the package so as to be able to support the package.