公开(公告)号：US20140048241A1

公开(公告)日：2014-02-20

申请号：US13660017

申请日：2012-10-25

申请人： SHIH-YAO LI ,  JUI-WEN HUNG ,  MING-HSIU CHUNG

发明人： SHIH-YAO LI ,  JUI-WEN HUNG ,  MING-HSIU CHUNG

IPC分类号： F28F21/08 ,  F28F7/00

CPC分类号： H01L23/3677 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat sink assembly includes a base plate for thermally contacting an electronic component and fins protruded from the base plate to dissipate heat transferred from the base plate by nature convection and thermal radiation. A heat conductive film is formed on an outer surface of the heat sink. A thermal radiation wavelength region of a far and middle infrared ray is located in a thermal radiation wavelength region of the heat conductive film.

摘要翻译： 示例性的散热器组件包括用于热接触电子部件的基板和从基板突出的翅片，以通过自然对流和热辐射散发从基板传递的热量。 导热膜形成在散热片的外表面上。 远红外线和中红外线的热辐射波长区域位于导热膜的热辐射波长区域中。

公开(公告)号：US08885346B2

公开(公告)日：2014-11-11

申请号：US13418366

申请日：2012-03-13

申请人： Shih-Yao Li ,  Jui-Wen Hung ,  Ching-Bai Hwang

发明人： Shih-Yao Li ,  Jui-Wen Hung ,  Ching-Bai Hwang

IPC分类号： H05K7/20

CPC分类号： F28F3/022 ,  F28D2021/0029 ,  F28F7/00 ,  F28F2255/02

摘要： An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

摘要翻译： 示例性电子设备包括印刷电路板，安装在印刷电路板的顶表面上的电子部件和散热装置。 散热装置接触电子部件以吸收由电子部件产生的热量，并通过自然对流和热辐射消散热量。 散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。 热毛发在电子设备的内部具有加热的气流波浪，以散发从基板传递的热量。

公开(公告)号：US20130342994A1

公开(公告)日：2013-12-26

申请号：US13570279

申请日：2012-08-09

申请人： SHIH-YAO LI ,  JUI-WEN HUNG ,  WEI-JEN HUANG

发明人： SHIH-YAO LI ,  JUI-WEN HUNG ,  WEI-JEN HUANG

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.

摘要翻译： 示例性的电子设备包括电子部件，散热装置，固定部件和容纳电子部件，散热装置和固定部件的壳体。 散热装置与电子部件热接触。 固定构件包括主体和从主体延伸的接合部。 接合部将散热装置固定在固定部件上。 紧固件延伸穿过壳体并接合固定构件的主体以将固定构件固定在壳体上。

公开(公告)号：US20130153178A1

公开(公告)日：2013-06-20

申请号：US13459095

申请日：2012-04-28

申请人： Shih-Yao LI ,  Jui-Wen HUNG ,  Ching-Bai HWANG ,  Wei-Jen HUANG

发明人： Shih-Yao LI ,  Jui-Wen HUNG ,  Ching-Bai HWANG ,  Wei-Jen HUANG

IPC分类号： F28D15/00

CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a bracket, a fan with an air inlet and an air outlet, and a heat sink mounted on the bracket. The bracket includes a plurality of rivets and clasps. Each of the clasps includes a mounting portion, an arm extending upwards from the mounting portion, and a hook portion extending from a top end of the arm and towards the mounting portion. The mounting portion is riveted on the bracket by a corresponding rivet. The fan includes a plurality of ears corresponding to the clasps. The hook portions of the clasps abut on top surfaces of the ears to fix the fan on the bracket. The fan defines a plurality of channels communicating the outlet of the fan.

摘要翻译： 散热装置包括支架，具有空气入口的风扇和空气出口以及安装在支架上的散热器。 支架包括多个铆钉和扣子。 每个扣环包括安装部分，从安装部分向上延伸的臂和从臂的顶端延伸并朝向安装部分的钩部。 安装部分通过相应的铆钉铆接在支架上。 风扇包括对应于扣子的多个耳朵。 钩子的钩部分靠在耳朵的顶表面上，以将风扇固定在支架上。 风扇限定了连通风扇出口的多个通道。

公开(公告)号：US20120266609A1

公开(公告)日：2012-10-25

申请号：US13216176

申请日：2011-08-23

申请人： CHIH-JEN LIU ,  JUI-WEN HUNG ,  SHIH-YAO LI

发明人： CHIH-JEN LIU ,  JUI-WEN HUNG ,  SHIH-YAO LI

IPC分类号： F25B21/04

CPC分类号： F25D31/007 ,  F25B21/04 ,  F25B2321/0251 ,  F25D2331/805

摘要： An exemplary can heating and cooling device includes a container made of thermally conductive material, a heat spreader with a heat spreading portion and a heat exchanging portion, and a heat exchanger with a thermoelectric cooling chip and a heat sink. The container includes an outer side wall with a planar thermal contacting section of the container. The heat spreading portion of the heat spreader contacts the outer side wall of the container. The heat exchanging portion of the heat spreader contacts the planar thermal contacting section of the container. The thermoelectric cooling chip includes a first surface thermally connected with the heat exchanging portion of the heat spreader, and a second surface thermally connected with the heat sink.

摘要翻译： 示例性的罐式加热和冷却装置包括由导热材料制成的容器，具有散热部分和热交换部分的散热器，以及具有热电冷却芯片和散热器的热交换器。 容器包括具有容器的平面热接触部分的外侧壁。 散热器的散热部接触容器的外侧壁。 散热器的热交换部分接触容器的平面热接触部分。 热电冷却芯片包括与散热器的热交换部分热连接的第一表面和与散热器热连接的第二表面。

公开(公告)号：US08854817B2

公开(公告)日：2014-10-07

申请号：US13570279

申请日：2012-08-09

申请人： Shih-Yao Li ,  Jui-Wen Hung ,  Wei-Jen Huang

发明人： Shih-Yao Li ,  Jui-Wen Hung ,  Wei-Jen Huang

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.

摘要翻译： 示例性的电子设备包括电子部件，散热装置，固定部件和容纳电子部件，散热装置和固定部件的壳体。 散热装置与电子部件热接触。 固定构件包括主体和从主体延伸的接合部。 接合部将散热装置固定在固定部件上。 紧固件延伸穿过壳体并接合固定构件的主体以将固定构件固定在壳体上。

公开(公告)号：US20130299213A1

公开(公告)日：2013-11-14

申请号：US13537068

申请日：2012-06-29

申请人： SHIH-YAO LI ,  JUI-WEN HUNG

发明人： SHIH-YAO LI ,  JUI-WEN HUNG

IPC分类号： F28D15/04 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the heat dissipation module to the PCB board. The heat dissipation module includes a heat pipe, and the heat pipe includes an evaporating section for directly contacting the electronic component and a condensing section. The fixing device includes a base, and a plurality of latches extending from a bottom surface of the base. The latches cooperatively define a space matching with the evaporating section of the heat pipe and partially receiving the evaporating section. The base abuts on the evaporating section thereby pressing the evaporating section to firmly and directly contact the electronic component.

摘要翻译： 一种用于从位于印刷电路板（PCB）上的电子部件散热的散热装置组件包括散热模块和用于将散热模块固定到PCB板的固定装置。 散热模块包括热管，并且热管包括用于直接接触电子部件和冷凝部的蒸发部。 定影装置包括基座和从底座的底面延伸的多个闩锁。 闩锁协调地限定与热管的蒸发部分匹配的空间并且部分地接收蒸发部分。 基座邻接蒸发部分，从而按压蒸发部分以牢固地直接接触电子部件。

公开(公告)号：US20130201630A1

公开(公告)日：2013-08-08

申请号：US13418366

申请日：2012-03-13

申请人： SHIH-YAO LI ,  JUI-WEN HUNG ,  CHING-BAI HWANG

发明人： SHIH-YAO LI ,  JUI-WEN HUNG ,  CHING-BAI HWANG

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： F28F3/022 ,  F28D2021/0029 ,  F28F7/00 ,  F28F2255/02

摘要： An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

摘要翻译： 示例性电子设备包括印刷电路板，安装在印刷电路板的顶表面上的电子部件和散热装置。 散热装置接触电子部件以吸收由电子部件产生的热量，并通过自然对流和热辐射消散热量。 散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。 热毛发在电子设备的内部具有加热的气流波浪，以散发从基板传递的热量。

公开(公告)号：US20130133862A1

公开(公告)日：2013-05-30

申请号：US13537064

申请日：2012-06-29

申请人： SHIH-YAO LI ,  JUI-WEN HUNG

发明人： SHIH-YAO LI ,  JUI-WEN HUNG

IPC分类号： F28D15/02

CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat dissipation device includes a heat absorbing base, a heat pipe thermally connected to the heat absorbing base, and a fixing member including a main body abutting to the heat absorbing base and two clamps extending from the main body, the heat pipe is sandwiched between the main body and the heat absorbing base, each of the clamps includes an arm portion and a curved portion extending from the arm portion toward the heat absorbing base, the arm portions of the two clamps clamp two opposite lateral sides of the heat absorbing base, the curved portions of the two clamps elastically clamp edges of the heat absorbing base away from the main body.

摘要翻译： 示例性的散热装置包括吸热基座，热连接到吸热基座的热管和固定构件，该固定构件包括抵靠吸热基座的主体和从主体延伸的两个夹具，热管夹在 在主体和吸热基座之间，每个夹具包括臂部和从臂部朝向吸热基部延伸的弯曲部，两个夹具的臂部夹持吸热基部的两个相对的侧面 两个夹具的弯曲部分将吸热基部的边缘弹性夹紧远离主体。