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公开(公告)号：US20120307217A1
公开(公告)日：2012-12-06
申请号：US13587512
申请日：2012-08-16
申请人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
发明人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
IPC分类号： G03B27/52
CPC分类号： H01L21/67225 , G03F7/7075 , G03F7/70991 , H01L21/67213
摘要： A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
摘要翻译： 提供了一种处理基板的方法和系统。 该系统包括涂覆单元，曝光前/曝光后处理单元和显影单元。 每个单元包括负载端口和索引模块。 前/后曝光处理单元包括布置在不同层中的第一和第二模块。 第一模块在曝光处理之前执行在晶片上涂覆保护层的工艺。 第二模块执行清洁晶片的处理和曝光处理之后的曝光后烘烤处理。
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公开(公告)号：US20100195066A1
公开(公告)日：2010-08-05
申请号：US12656425
申请日：2010-01-29
申请人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
发明人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
IPC分类号： G03B27/42
CPC分类号： H01L21/67225 , G03F7/7075 , G03F7/70991 , H01L21/67213
摘要： A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
摘要翻译： 提供了一种处理基板的方法和系统。 该系统包括涂覆单元，曝光前/曝光后处理单元和显影单元。 每个单元包括负载端口和索引模块。 前/后曝光处理单元包括布置在不同层中的第一和第二模块。 第一模块在曝光处理之前执行在晶片上涂覆保护层的工艺。 第二模块执行清洁晶片的处理和曝光处理之后的曝光后烘烤处理。
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公开(公告)号：US09059224B2
公开(公告)日：2015-06-16
申请号：US13587512
申请日：2012-08-16
申请人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
发明人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
CPC分类号： H01L21/67225 , G03F7/7075 , G03F7/70991 , H01L21/67213
摘要： A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
摘要翻译： 提供了一种处理基板的方法和系统。 该系统包括涂覆单元，曝光前/曝光后处理单元和显影单元。 每个单元包括负载端口和索引模块。 前/后曝光处理单元包括以不同层布置的第一和第二模块。 第一模块在曝光处理之前执行在晶片上涂覆保护层的工艺。 第二模块执行清洁晶片的处理和曝光处理之后的曝光后烘烤处理。
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公开(公告)号：US08289496B2
公开(公告)日：2012-10-16
申请号：US12656425
申请日：2010-01-29
申请人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
发明人： Dong Ho Kim , Jinyoung Choi , Jaeseung Go , Soomin Hwang
CPC分类号： H01L21/67225 , G03F7/7075 , G03F7/70991 , H01L21/67213
摘要： A method and system for treating a substrate are provided. The system includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a process for coating a protective layer on the wafer before an exposure process. The second module performs a process for cleaning the wafer and a post-exposure bake process after the exposure process.
摘要翻译： 提供了一种处理基板的方法和系统。 该系统包括涂覆单元，曝光前/曝光后处理单元和显影单元。 每个单元包括负载端口和索引模块。 前/后曝光处理单元包括布置在不同层中的第一和第二模块。 第一模块在曝光处理之前执行在晶片上涂覆保护层的工艺。 第二模块执行清洁晶片的处理和曝光处理之后的曝光后烘烤处理。
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