公开(公告)号：US5787578A

公开(公告)日：1998-08-04

申请号：US677257

申请日：1996-07-09

申请人： Shaji Farooq ,  Suryanarayana Kaja ,  John U. Knickerbocker ,  Brenda Peterson ,  Srinivasan N. Reddy ,  Rao V. Vallabhaneni ,  Donald R. Wall

发明人： Shaji Farooq ,  Suryanarayana Kaja ,  John U. Knickerbocker ,  Brenda Peterson ,  Srinivasan N. Reddy ,  Rao V. Vallabhaneni ,  Donald R. Wall

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/24 ,  H01R9/00

CPC分类号： H05K3/248 ,  H01L21/4846 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/0285 ,  H05K3/04 ,  Y10T29/49149 ,  Y10T29/49163

摘要： Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.

摘要翻译： 公开了一种在陶瓷基板上的金属特征上选择性地沉积金属层的方法。 金属层优选可以是元素镍颗粒，元素铜颗粒，铜和镍颗粒的混合物，或铜/镍合金颗粒。 金属层以包含金属颗粒和粘合剂材料的糊状混合物沉积。 通过随后的加热步骤，金属层紧密地结合到金属特征，但是仅松散地结合到陶瓷基底。 此后，施加超声波处理以去除陶瓷基板上的松散粘附的金属层。 通过超声波处理，金属层上的紧密结合的金属层不被除去。