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公开(公告)号:US06793798B2
公开(公告)日:2004-09-21
申请号:US10084471
申请日:2002-02-28
IPC分类号: C25D900
CPC分类号: A61K51/12 , A61K51/1282 , A61N5/1002 , A61N2005/1019
摘要: This invention relates to radioactively coated devices, preferably radioactively coated medical devices. These coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coating, and are therefore suitable for use within biological systems. Methods for coating a device with a radioisotope comprising are also disclosed. One method comprises immersing the device within a solution containing a &Ugr;, &bgr;+, &agr;, &bgr;− or &egr; (electron capture) emitting radioisotope, then exposing the immersed substrate to tuned vibrational cavitation to produce a coated substrate. A second method involves coating a substrate using electroless plating, and yet a third method involves the use of electroplating a radioisotope onto a substrate of interest. With these methods, the coating procedures are followed by baking the coated substrate at a temperature below the recrystallization temperature of the substrate. Substrates coated using the methods of this invention exhibit very low rates of leaching of the coated radioisotope, and are suitable for use within medical applications, for example as stents, catheters, seeds, protheses, vavles, staples and other wound closure devices, where a localized therapeutic treatment is desired.
摘要翻译: 本发明涉及放射性涂覆的装置,优选放射性涂覆的医疗装置。 这些涂覆装置的特征在于放射性同位素从涂覆装置的表面浸出的速度低,并且具有均匀的放射性涂层,因此适用于生物系统。 还公开了包含放射性同位素的装置的涂覆方法。 一种方法包括将装置浸入含有Upsilon,β+,α,β - 或ε(电子捕获)发射放射性同位素的溶液中,然后将浸没的基材暴露于调谐的振动空化以产生涂覆的基底。 第二种方法包括使用无电电镀来涂覆基底,而第三种方法涉及将放射性同位素电镀到感兴趣的底物上。 利用这些方法,涂覆过程之后,在低于基材的再结晶温度的温度下烘烤涂覆的基材。 使用本发明的方法涂覆的底物显示出非常低的涂覆放射性同位素浸出率,并且适用于医疗应用中,例如作为支架,导管,种子,补片,气泡,缝钉和其它伤口闭合装置,其中 需要局部治疗。
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公开(公告)号:US6103295A
公开(公告)日:2000-08-15
申请号:US995524
申请日:1997-12-22
IPC分类号: A61F2/82 , A61K51/12 , A61L31/00 , A61M36/12 , A61N5/10 , A61M36/14 , A61M36/00 , B05D1/18 , B05D3/02
CPC分类号: A61K51/1282 , A61K51/12 , A61N5/1002
摘要: A method for coating a substrate with a radioisotope comprising is disclosed. The method comprises immersing the substrate within a solution containing a .gamma., .beta..sup.+, .alpha. or .beta..sup.- emitting radioisotope, then exposing the immersed substrate to tuned vibrational cavitation (i.e. ultrasonic) to produce a coated substrate, followed by baking the coated substrate at a temperature below the recrystallization temperature of the substrate. Following this step, the substrate is rinsed and dried. Substrates coated using the method of this invention exhibit very low rates of leaching of the coated radioisotope, and are suitable for use within medical applications.
摘要翻译: 公开了一种用放射性同位素涂覆衬底的方法。 该方法包括将衬底浸入含有γ,β+,α或β发射放射性同位素的溶液中,然后将浸没的基底暴露于调谐的振动空化(即超声波)以产生涂覆的基底,然后在 温度低于衬底的再结晶温度。 在该步骤之后,将基底冲洗并干燥。 使用本发明方法涂覆的底物表现出非常低的涂覆放射性同位素浸出率,并且适用于医疗应用。
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公开(公告)号:US06394945B1
公开(公告)日:2002-05-28
申请号:US09559538
申请日:2000-04-28
IPC分类号: A61N500
CPC分类号: A61K51/12 , A61K51/1282 , A61N5/1002 , A61N2005/1019
摘要: This invention relates to radioactively coated devices, preferably radioactively coated medical devices. These coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coating, and are therefore suitable for use within biological systems. Coated medical devices are disclosed that are produced either by immersing the device within a solution containing a &ggr;, &bgr;+, &agr;, &bgr;−, &Egr; (electron capture) emitting radioisotope, then exposing the immersed substrate to tuned vibrational cavitation, by electroless plating, or by electroplating a radioisotope onto a substrate of interest. The medical devices so produced are then baked at a temperature below the recrystallization temperature of the medical device. Medical devices as described herein exhibit very low rates of leaching of the coated radioisotope, and are suitable for use within medical applications, for example as stents, catheters, seeds, protheses, vavles, staples and other wound closure devices, where a localized therapeutic treatment is desired.
摘要翻译: 本发明涉及放射性涂覆的装置,优选放射性涂覆的医疗装置。 这些涂覆装置的特征在于放射性同位素从涂覆装置的表面浸出的速度低,并且具有均匀的放射性涂层,因此适用于生物系统。 公开了涂覆的医疗装置,其通过将装置浸入含有γ,β+,α,β - 和Egr的溶液中而制备; (电子捕获),然后通过无电镀或通过将放射性同位素电镀到感兴趣的衬底上而使浸没的衬底暴露于调谐的振动空化。 然后将如此生产的医疗装置在低于医疗装置的再结晶温度的温度下烘烤。 如本文所述的医疗装置表现出非常低的涂覆放射性同位素浸出率,并且适用于医疗应用中,例如作为支架,导管,种子,补片,气泡,缝钉和其它伤口闭合装置,其中局部治疗处理 是希望的。
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公开(公告)号:US06676988B2
公开(公告)日:2004-01-13
申请号:US10014606
申请日:2001-12-14
IPC分类号: A61L2700
CPC分类号: A61K51/12 , A61K51/1282 , A61N5/1002 , A61N2005/1019
摘要: This invention relates to radioactively coated devices, preferably radioctively coated medical devices. These coated devices are characterized as having a low rate of leaching of the radioisotope from the surface of the coated device and a uniform radioactive coating, and are therefore suitable for use within biological systems. Methods for coating a device with a radioisotope comprising are also disclosed. One method comprises immersing the device within a solution containing a &ggr;, &bgr;+, &agr;, &bgr;− or &egr; (electron capture) emitting radioisotope, then exposing the immersed substrate to tuned vibrational cavitation to produce a coated substrate. A second method involves coating a substrate using electroless plating, and yet a third method involves the use of electroplating a radioisotope onto a substate of interest. With these methods, the coating procedures are followed by baking the coated substrate at a temperature below the recrystallization temperature of the substrate. Substrates coated using the methods of this invention exhibit very low rates of leaching of the coated radioisotope, and are suitable for use within medical applications, for example as stents, catheters, seeds, protheses, vavles, staples and other wound closure devices, where a localized therapeutic treatment is desired.
摘要翻译: 本发明涉及放射性涂覆的装置,优选放射性涂覆的医疗装置。 这些涂覆装置的特征在于放射性同位素从涂覆装置的表面浸出的速度低,并且具有均匀的放射性涂层,因此适用于生物系统。 还公开了包含放射性同位素的装置的涂覆方法。 一种方法包括将装置浸入含有γ,β,α,β或ε(电子捕获)发射放射性同位素的溶液中,然后将浸没的基底暴露于调谐的振动空化以产生涂覆的基底。 第二种方法包括使用无电镀来涂覆基底,然而第三种方法涉及将放射性同位素电镀到感兴趣的基底上。 利用这些方法,涂覆过程之后,在低于基材的再结晶温度的温度下烘烤涂覆的基材。 使用本发明的方法涂覆的底物显示出非常低的涂覆放射性同位素浸出率,并且适用于医疗应用中,例如作为支架,导管,种子,补片,气泡,缝钉和其它伤口闭合装置,其中 需要局部治疗。
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