-
公开(公告)号:US5227280A
公开(公告)日:1993-07-13
申请号:US754847
申请日:1991-09-04
CPC分类号: G03F7/0045 , G03F7/094
摘要: A PMGI bilayer resist for integrated circuit fabrication having increased sensitivity to light and formed by the addition of cyclic anhydrides to the resist and the formation of an accompanying bilayer resist structure of a portable conforming mask having a desirable undercut profile for lift-off of patterned metallic circuitry.
摘要翻译: 用于集成电路制造的PMGI双层抗蚀剂具有增加的光的灵敏度并通过向抗蚀剂添加环状酸酐形成,并形成具有用于剥离图案化金属的期望的底切轮廓的便携式贴合掩模的伴随双层抗蚀剂结构 电路。