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    Laser induced bond delamination
    1.
    发明授权
    Laser induced bond delamination 有权
    激光诱导键分层

    公开(公告)号：US08132460B1

    公开(公告)日：2012-03-13

    申请号：US12435448

    申请日：2009-05-05

    申请人： Steven M. Toller ,  Jeff L. Dulaney

    发明人： Steven M. Toller ,  Jeff L. Dulaney

    IPC分类号： G01N29/04

    CPC分类号： G01N29/2412 ,  G01N29/2418 ,  G01N2291/015 ,  G01N2291/0231 ,  G01N2291/0258 ,  G01N2291/02854 ,  G01N2291/0421 ,  G01N2291/2672 ,  G01N2291/2694

    摘要： Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.

    摘要翻译： 提供了方法，系统和装置，用于在粘合结合物内以受控的方式产生粘结分层。 在一个实施例中，用于引起粘合制品的粘合中的缺陷的系统包括激光和激光处理器头。 激光处理器头包括壳体，设置在壳体内的透镜，设置在壳体内的至少一个磁体和设置在壳体内的至少一个传感器。 该系统能够应用足够的能量注量的激光脉冲来引起键的局部弱点。

    Method of modifying a workpiece following laser shock processing
    4.
    发明授权
    Method of modifying a workpiece following laser shock processing 有权
    激光冲击加工后修改工件的方法

    公开(公告)号：US07470335B2

    公开(公告)日：2008-12-30

    申请号：US11023228

    申请日：2004-12-27

    申请人： Steven M. Toller ,  Allan H. Clauer ,  Jeff L. Dulaney

    发明人： Steven M. Toller ,  Allan H. Clauer ,  Jeff L. Dulaney

    IPC分类号： C21D1/09

    CPC分类号： C22F3/00 ,  C21D10/005 ,  C21D2261/00 ,  Y10T428/12493

    摘要： A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.

    摘要翻译： 制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。 在一个步骤中，材料从加工的工件的压缩残余应力区域移除。 替代地，工件可以设置有尺寸过大的尺寸，使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。 替代地，材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。 或者，对工件进行第一次高强度激光冲击加工处理，然后从压缩残余应力区域去除材料，然后对工件进行第二次低强度激光冲击加工处理。 材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。 材料也可以沉积到激光冲击处理的表面上。

    Method of positioning a workpiece for optimal processing
    6.
    发明授权
    Method of positioning a workpiece for optimal processing 失效
    定位工件的最佳加工方法

    公开(公告)号：US06483076B1

    公开(公告)日：2002-11-19

    申请号：US09564360

    申请日：2000-05-02

    申请人： Mark E. O'Loughlin ,  Steven M. Toller ,  Jeff L. Dulaney

    发明人： Mark E. O'Loughlin ,  Steven M. Toller ,  Jeff L. Dulaney

    IPC分类号： B23K2600

    CPC分类号： C21D10/005 ,  B23Q15/22 ,  B23Q16/00 ,  B23Q17/22 ,  G05B2219/50151

    摘要： A method of producing a workpiece involves positioning the workpiece at a current processing position indicated by a hard-coded part program and then collecting position data which defines the positional arrangement of a current target area of the workpiece. The collected position data is processed by comparing it to reference position information that represents the positional arrangement of the same target area in an ideal workpiece employed in the development of the part program. The position of the workpiece (and hence the target area) is adjusted in accordance with the comparison results. A laser shock processing operation is performed on the workpiece at the current target area following the position adjustment step.

    摘要翻译： 制造工件的方法包括将工件定位在由硬编码部件程序指示的当前处理位置，然后收集定义工件的当前目标区域的位置布置的位置数据。 通过将收集的位置数据与表示在零件程序的开发中使用的理想工件中的相同目标区域的位置布置的参考位置信息进行比较来处理。 根据比较结果调整工件的位置（以及目标面积）。 在位置调整步骤之后的当前目标区域上对工件执行激光冲击处理操作。

    Method of modifying a workpiece following laser shock processing
    8.
    发明授权
    Method of modifying a workpiece following laser shock processing 有权
    激光冲击加工后修改工件的方法

    公开(公告)号：US07776165B1

    公开(公告)日：2010-08-17

    申请号：US12201519

    申请日：2008-08-29

    申请人： Jeff L. Dulaney ,  Steven M. Toller ,  Allan H. Clauer

    发明人： Jeff L. Dulaney ,  Steven M. Toller ,  Allan H. Clauer

    IPC分类号： C21D1/09

    CPC分类号： C22F3/00 ,  C21D10/005 ,  C21D2261/00 ,  Y10T428/12493

    摘要： A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.

    摘要翻译： 制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。 在一个步骤中，材料从加工的工件的压缩残余应力区域移除。 替代地，工件可以设置有尺寸过大的尺寸，使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。 替代地，材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。 或者，对工件进行第一次高强度激光冲击加工处理，然后从压缩残余应力区域去除材料，然后对工件进行第二次低强度激光冲击加工处理。 材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。 材料也可以沉积到激光冲击处理的表面上。

    Apparatus and method for non-destructive testing
    9.
    发明申请
    Apparatus and method for non-destructive testing 有权
    无损检测装置及方法

    公开(公告)号：US20080257048A1

    公开(公告)日：2008-10-23

    申请号：US11227745

    申请日：2005-09-15

    申请人： Craig T. Walters ,  Steven M. Toller

    发明人： Craig T. Walters ,  Steven M. Toller

    IPC分类号： G01N29/04 ,  G01N23/00

    CPC分类号： G01N29/2412 ,  G01N29/043 ,  G01N29/4454 ,  G01N2291/0231 ,  G01N2291/267 ,  G01N2291/2694

    摘要： A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.

    摘要翻译： 一种用于实现粘结结构实时检查的诊断手段。 所公开的装置从前侧（射束施加侧）检测在轴上的接合失效应力波。 Pi-box和pi-rail EMAT测量仪可用于所公开的装置。 还可以采用感应耦合的EMAT。 提供了一种将询问激光束远程传送到表面的改进方法。 处理头可以利用水柱或水膜。 水膜处理头可以包括使用单个水膜或两个间隔开的水膜。 所公开的装置可以与粘合的复合结构，使用各种材料的结合结构一起使用，并且确定未粘合的固体材料的动态强度。 该装置还可以用于需要将局部应力波远程灵活递送到材料和/或所得到的应力波的诊断的其它应用中。

    Method of modifying a workpiece following laser shock processing
    10.
    发明授权
    Method of modifying a workpiece following laser shock processing 失效
    激光冲击加工后修改工件的方法

    公开(公告)号：US06852179B1

    公开(公告)日：2005-02-08

    申请号：US09590866

    申请日：2000-06-09

    申请人： Steven M. Toller ,  Allan H. Clauer ,  Jeff L. Dulaney

    发明人： Steven M. Toller ,  Allan H. Clauer ,  Jeff L. Dulaney

    IPC分类号： C21D10/00 ,  C22F3/00

    CPC分类号： C22F3/00 ,  C21D10/005 ,  C21D2261/00 ,  Y10T428/12493

    摘要： A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.

    摘要翻译： 制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。 在一个步骤中，材料从加工的工件的压缩残余应力区域移除。 替代地，工件可以设置有尺寸过大的尺寸，使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。 替代地，材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。 或者，对工件进行第一次高强度激光冲击加工处理，然后从压缩残余应力区域去除材料，然后对工件进行第二次低强度激光冲击加工处理。 材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。 材料也可以沉积到激光冲击处理的表面上。