-
公开(公告)号：US6127649A
公开(公告)日：2000-10-03
申请号：US457033
申请日：1999-12-08
CPC分类号： B23K26/123 , B23K26/12 , B23K26/127 , B23K26/142 , B23K26/1438 , C21D10/005 , Y02P10/212
摘要： An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator disposed therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.
摘要翻译： 创建用于激光喷丸操作的处理单元的设备包括基本上限定工作单元或处理单元的外壳，其中布置有透明覆盖材料施加器。 使用清洁系统，其可以包括蒸汽排放，液体去除系统和气体或空气供应。 蒸汽排气系统连接到外壳，用于从处理室内除去蒸气。 液体去除系统连接到外壳，用于从处理单元去除液体。 气体或空气源连接到外壳，用气体或空气冲洗外壳，以冲洗空气中的碎屑。 工件操纵器可以在电池内设置或操作，用于在其中移动工件。
-
公开(公告)号：US06288358B1
公开(公告)日：2001-09-11
申请号：US09211553
申请日：1998-12-15
IPC分类号： B23K2600
CPC分类号： B23K26/009 , B23K26/032 , B23K26/042 , B23K26/0884 , B23K26/127 , B23K26/1476 , B23K26/18 , B23K26/356 , B64F5/10 , C21D10/005
摘要： A remote laser shock processing system for improving the properties of a solid workpiece by providing shock waves therein. The system includes a remote output end and a laser beam delivery arrangement for directing a beam of coherent energy to a specific location along a workpiece. In addition, a method of utilizing the remote laser shock processing system is included.
摘要翻译： 一种远程激光冲击处理系统，用于通过在其中提供冲击波来改善固体工件的性能。 该系统包括远程输出端和用于将一束相干能量沿着工件引导到特定位置的激光束传送装置。 此外，还包括使用远程激光冲击处理系统的方法。
-
公开(公告)号：US06359257B1
公开(公告)日：2002-03-19
申请号：US09253156
申请日：1999-02-19
IPC分类号： B23K2600
CPC分类号： C21D10/005 , B23K26/16 , Y02P10/212
摘要： An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.
摘要翻译： 一种用于提供在激光冲击处理期间使用的基本无碎屑的激光束路径的装置和方法。 该方法和装置包括用于从激光束路径去除碎屑的系统和用于防止碎片进入激光束路径的系统。
-
公开(公告)号：US6064035A
公开(公告)日：2000-05-16
申请号：US777
申请日：1997-12-30
CPC分类号： B23K26/123 , B23K26/12 , B23K26/127 , B23K26/142 , B23K26/1438 , C21D10/005 , Y02P10/212
摘要： An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator located therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.
摘要翻译： 创建用于激光喷丸操作的处理单元的装置包括基本上限定工作单元或处理单元的外壳，其具有位于其中的透明覆盖材料施加器。 使用清洁系统，其可以包括蒸汽排放，液体去除系统和气体或空气供应。 蒸汽排气系统连接到外壳，用于从处理室内除去蒸气。 液体去除系统连接到外壳，用于从处理单元去除液体。 气体或空气源连接到外壳，用气体或空气冲洗外壳，以冲洗空气中的碎屑。 工件操纵器可以在电池内设置或操作，用于在其中移动工件。
-
5.发明授权
公开(公告)号：US6049058A
公开(公告)日：2000-04-11
申请号：US211568
申请日：1998-12-15
CPC分类号： C21D10/005 , B23K26/122 , Y02P10/212
摘要： A method and apparatus for improving properties of a solid material by providing shock waves therethrough. Laser shock processing is used to provide the shock waves. The method includes applying a transparent overlay to the solid material to be worked. The solid material or overlay is vibrated to release any gas bubbles or solid debris within the transparent layer which could cause localized non-uniform confinement of a pressure pulse applied for a workpiece thereby causing irregularities in the workpiece surface. A pulse of coherent laser energy is the directed to the coated portion of the solid material to create a shock wave. Additionally, the method may include adding a wetting agent or controlling the temperature of the overlay material to reduce the concentration of gas bubbles therein.
摘要翻译： 一种通过提供冲击波来改善固体材料性能的方法和装置。 激光冲击加工用于提供冲击波。 该方法包括将透明覆盖层应用于待加工的固体材料。 振动固体材料或覆盖层以释放透明层内的任何气泡或固体碎屑，这可能导致对工件施加的压力脉冲的局部不均匀约束，从而导致工件表面的凹凸。 相干激光能量的脉冲是指向固体材料的涂覆部分以产生冲击波。 此外，该方法可以包括添加润湿剂或控制覆盖材料的温度以减少其中气泡的浓度。
-
公开(公告)号：US06566629B1
公开(公告)日：2003-05-20
申请号：US09307117
申请日：1999-05-07
IPC分类号： B23K2600
CPC分类号： B23K26/064 , B23K26/06 , B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/356
摘要： A laser processing method for processing a hidden surface of a workpiece, the hidden surface being disposed within a recess having an opening. The method includes inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of a workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface. In one particular embodiment, the reflective member is specifically shaped toprovide diction of a pulse of coherent energy to a hidden surface so that a substantially uniform energy density is applied to the hidden surface. In an additional embodiment, the method is optimized for preventing damage to the reflective member. In one particular embodiment, the reflective member is composed of a fluid.
摘要翻译： 一种用于处理工件的隐藏表面的激光加工方法，所述隐藏表面设置在具有开口的凹部内。 该方法包括将反射构件插入凹槽中并且引导相干能量的脉冲以反射离开所述反射构件并撞击工件的隐藏表面以产生冲击波。 改变凹坑的表面可以被修改为激光冲击处理隐藏的表面。 在一个具体实施例中，反射构件被特定地形成为隐藏表面的相干能量的脉冲，使得基本均匀的能量密度被施加到隐藏的表面。 在另外的实施例中，该方法被优化以防止对反射构件的损坏。 在一个具体实施例中，反射构件由流体组成。
-
公开(公告)号：US06521860B2
公开(公告)日：2003-02-18
申请号：US09952968
申请日：2001-09-13
IPC分类号： B23K2600
CPC分类号： C21D10/005 , B23K26/16 , Y02P10/212
摘要： An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.
-
公开(公告)号：US06512584B1
公开(公告)日：2003-01-28
申请号：US09106793
申请日：1998-06-29
IPC分类号： G01B1100
CPC分类号： C21D10/005
摘要： A method of testing the operation of a laser peening system includes providing a sensor in a possible laser beam path, applying a transparent overlay material to the sensor, directing a pulse of coherent energy to the sensor through the transparent overlay material to create a shock wave, and determining a characteristic of the created shock wave with the sensor.
摘要翻译： 测试激光喷丸系统的操作的方法包括提供可能的激光束路径中的传感器，将透明覆盖材料施加到传感器，通过透明覆盖材料将相干能量的脉冲引导到传感器以产生冲击波 ，并且利用传感器确定产生的冲击波的特性。
-
公开(公告)号：US06292584B1
公开(公告)日：2001-09-18
申请号：US09057107
申请日：1998-04-08
IPC分类号： G06K900
CPC分类号： C21D10/005 , B23K26/032 , B23K26/0643 , B23K26/0648 , B23K26/356
摘要： An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.
摘要翻译： 用于监测激光喷丸处理的图像处理系统包括具有工件定位器和系统控制器的激光喷丸机。 利用摄像机形成工件的至少一部分的电子图像。 图像处理计算机连接到摄像机，激光喷丸控制器包括用于确定工件位置的程序。
-
公开(公告)号：US06683976B2
公开(公告)日：2004-01-27
申请号：US09846494
申请日：2001-04-30
IPC分类号： G06K900
CPC分类号： C21D10/005 , B23K26/032 , B23K26/0643 , B23K26/0648 , B23K26/356
摘要： An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.
摘要翻译： 用于监测激光喷丸处理的图像处理系统包括具有工件定位器和系统控制器的激光喷丸机。 利用摄像机形成工件的至少一部分的电子图像。 图像处理计算机连接到摄像机，激光喷丸控制器包括用于确定工件位置的程序。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.023 秒)
