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公开(公告)号:US07807241B2
公开(公告)日:2010-10-05
申请号:US10556912
申请日:2004-05-14
申请人: Masahiro Sasagawa , Katsumi Suzuki , Toshinori Shiraki , Jae Yeon Lee , Jun Choi Pil , Suk Hun Sur , Dae Shik Kim
发明人: Masahiro Sasagawa , Katsumi Suzuki , Toshinori Shiraki , Jae Yeon Lee , Jun Choi Pil , Suk Hun Sur , Dae Shik Kim
CPC分类号: C08L53/02 , B32B5/022 , B32B5/024 , B32B5/18 , B32B7/12 , B32B25/02 , B32B25/04 , B32B25/042 , B32B25/045 , B32B25/14 , B32B25/16 , B32B2250/03 , B32B2262/12 , B32B2266/0207 , B32B2307/30 , B32B2307/306 , B32B2307/546 , B32B2307/554 , B32B2307/558 , B32B2437/02 , B32B2439/06 , B32B2601/00 , B32B2605/00 , B32B2607/02 , C08G18/776 , C08L51/04 , C08L53/025 , C08L2666/02 , C09J151/04 , C09J153/02 , C09J153/025 , Y10T428/1334 , Y10T428/1341 , Y10T428/1352 , Y10T428/1362 , Y10T428/1372 , Y10T428/1376 , Y10T428/1379 , Y10T428/1386 , Y10T428/139 , Y10T428/1393 , Y10T428/28 , Y10T428/31917 , Y10T428/3192 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/24
摘要: A hydrogenated copolymer-containing laminate comprising a substrate layer, an adhesive layer, and a hydrogenated copolymer composition layer which is laminated on and bonded to the substrate layer through the adhesive layer, the hydrogenated copolymer composition layer comprising a hydrogenated copolymer (I), and a rubbery polymer (II), wherein the hydrogenated copolymer (I) is obtained by hydrogenating a conjugated diene/vinyl aromatic compound copolymer, the hydrogenated copolymer (I) having the following characteristics (1) to (4): (1) a vinyl aromatic monomer unit content of from more than 50% by weight to 90% by weight, (2) a content of a vinyl aromatic polymer block of not more than 40% by weight, (3) a weight average molecular weight of from 50,000 to 1,000,000, and (4) a hydrogenation ratio of 70% or more, as measured with respect to the double bonds in conjugated diene monomer units.
摘要翻译: 一种含氢化共聚物的层压体,其包含通过所述粘合剂层层合并粘合到所述基材层上的基材层,粘合剂层和氢化共聚物组合物层,所述氢化共聚物组合物层包含氢化共聚物(I)和 一种橡胶状聚合物(II),其中通过氢化共轭二烯/乙烯基芳族化合物共聚物,具有以下特征(1)至(4)的氢化共聚物(I)获得氢化共聚物(I):(1)乙烯基 芳族单体单元含量为50重量%〜90重量%,(2)乙烯基芳族聚合物嵌段的含量为40重量%以下,(3)重均分子量为50,000〜 1,000,000,(4)相对于共轭二烯单体单元中的双键测定的氢化率为70%以上。