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    Lightweight preform having a decreased weight support ring
    7.
    发明授权
    Lightweight preform having a decreased weight support ring 有权
    重量轻的预型件具有减重的支撑环

    公开(公告)号：US09533788B2

    公开(公告)日：2017-01-03

    申请号：US13916183

    申请日：2013-06-12

    申请人： Patrick Michael Calello

    发明人： Patrick Michael Calello

    IPC分类号： B29B11/14 ,  B65D1/02 ,  B29K67/00 ,  B29C49/00 ,  B29C49/06

    CPC分类号： B65D1/0246 ,  B29B11/14 ,  B29B2911/1402 ,  B29B2911/14026 ,  B29B2911/14033 ,  B29B2911/1404 ,  B29B2911/14326 ,  B29B2911/14446 ,  B29B2911/14473 ,  B29C49/0073 ,  B29C49/06 ,  B29C2793/0027 ,  B29C2793/009 ,  B29C2795/002 ,  B29K2067/003 ,  Y10T428/1352 ,  Y10T428/1376

    摘要： A lightweight polyester preform is disclosed for the production of light weight polyester containers by blow molding. The preforms and the resulting blown containers have threads on an exterior surface adjacent an upper end. Adjacent to and located below the threads is a support ring. The support ring is used in handling and conveying a preform from injection molding to a blow mold and in blow molding the container from the preform. It also is used in handling and conveying the preform from storage to the blow mold. To lightweight the preform, and subsequent container, the support ring is designed to have a minimum weight, but a sufficient strength for the handling of the preform in the production of the blow molded container. The support ring is reduced in weight by about 10% to about 70% from a conventional preform support ring.

    摘要翻译： 公开了一种轻质聚酯预成型件，用于通过吹塑生产轻质聚酯容器。 预成型件和所得到的吹塑容器在与上端相邻的外表面上具有螺纹。 相邻并位于线下方的是支撑环。 支撑环用于从注射成型到吹塑模具的处理和输送预成型件以及从预制件吹塑容器。 它也用于从储存到吹塑模具的处理和输送预制件。 为了使预成型件和随后的容器轻便，支撑环设计成具有最小重量，但是具有足够的强度用于在生产吹塑容器时处理预制件。 支撑环从传统的预制件支撑环减轻约10％至约70％。

    Buffer material for packing wafer carrier
    8.
    发明授权
    Buffer material for packing wafer carrier 有权
    用于包装晶片载体的缓冲材料

    公开(公告)号：US09455168B2

    公开(公告)日：2016-09-27

    申请号：US13943249

    申请日：2013-07-16

    申请人： SUMCO CORPORATION

    发明人： Tomohiro Horio

    IPC分类号： B65D81/02 ,  H01L21/673

    CPC分类号： H01L21/67369 ,  B65D81/05 ,  B65D2585/86 ,  Y10T428/1376

    摘要： At the time of packing a wafer carrier into a container, an upper buffer body and a lower buffer body are arranged above and below the wafer carrier. The wafer carrier has: a box-like carrier main body having a frame-like step portion formed on an upper inner peripheral surface of an access opening; and a lid body that closes the access opening in an openable manner when it is accommodated in the frame-like step portion through a gasket. Further, the upper buffer body has: an upper concave portion that accommodates an upper portion of the wafer carrier therein; and a pressing rib that is brought into contact with an upper end surface of a carrier main body and pressed against the upper end surface of the carrier main body without contacting with the lid body. Furthermore, the lower buffer body has: a lower concave portion and a support portion.

    摘要翻译： 在将晶片载体包装到容器中时，上部缓冲体和下部缓冲体布置在晶片载体的上方和下方。 晶片载体具有：箱状载体主体，其具有形成在进入开口的上部内周面上的框状台阶部; 以及盖体，其通过垫圈容纳在框状台阶部中时以可打开的方式封闭进入口。 此外，上缓冲体具有：上凹部，其容纳晶片载体的上部; 以及与载体主体的上端面接触并且压靠承载器主体的上端面而不与盖体接触的按压肋。 此外，下缓冲体具有：下凹部和支撑部。

    REUSABLE ENCAPSULATION LAYER SUPPORT PLATE AND METHOD OF ENCAPSULATING OLED SUBSTRATE
    10.
    发明申请
    REUSABLE ENCAPSULATION LAYER SUPPORT PLATE AND METHOD OF ENCAPSULATING OLED SUBSTRATE 有权
    可重复使用的包层支撑板和封装OLED基板的方法

    公开(公告)号：US20150372202A1

    公开(公告)日：2015-12-24

    申请号：US14527556

    申请日：2014-10-29

    申请人： BOE TECHNOLOGY GROUP CO., LTD.

    发明人： Wei Wang

    IPC分类号： H01L33/54

    CPC分类号： H01L51/00 ,  H01L51/524 ,  Y10T428/1376

    摘要： The embodiments of the present invention disclose a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reused as far as possible. The embodiments of the present invention further disclose a method of encapsulating an OLED substrate using the encapsulation layer support plate.

    摘要翻译： 本发明的实施例公开了一种可重复使用的封装层支撑板，包括：支撑板主体，支撑板主体的顶部设置有至少一个用于容纳封装层的第一开口; 布置在所述支撑板主体内的空腔，所述空腔填充有多孔材料，并且所述空腔的顶部具有至少一个第二开口; 其中所述第一开口与所述第二开口连接并布置成与所述第二开口相对，并且所述多孔材料的顶表面平行并与所述第一开口的底表面平齐。 封装层支撑板可以避免OLED基板的碰撞，实现有效的OLED封装，并且可以尽可能重复使用。 本发明的实施例还公开了一种使用封装层支撑板封装OLED基板的方法。