公开(公告)号：US4902732A

公开(公告)日：1990-02-20

申请号：US928654

申请日：1986-11-05

申请人： Kunio Itoh ,  Sumiko Komiya ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yoshio Fujimura

发明人： Kunio Itoh ,  Sumiko Komiya ,  Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Yoshio Fujimura

IPC分类号： C08G77/42 ,  C08L63/00 ,  C08L83/10 ,  H01B3/36 ,  H01B3/40 ,  H01B3/46

CPC分类号： H01B3/46 ,  C08G77/42 ,  C08L63/00 ,  C08L83/10 ,  H01B3/36 ,  H01B3/40

摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.

摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。