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公开(公告)号：US4902732A
公开(公告)日：1990-02-20
申请号：US928654
申请日：1986-11-05
摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.
摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。
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公开(公告)号：US5053445A
公开(公告)日：1991-10-01
申请号：US397739
申请日：1989-08-23
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
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公开(公告)号：US4877822A
公开(公告)日：1989-10-31
申请号：US179538
申请日：1988-04-08
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要翻译： 一种环氧树脂组合物，其包含可固化环氧树脂，固化剂，无机填料和至少一种共聚物，所述共聚物选自通过在含有一个或多个环氧基和一个或多个烯基的芳族聚合物之间的加成反应获得的共聚物， 有机聚硅氧烷; 通过含有一个或多个环氧基的芳族聚合物与特定含氨基的有机聚硅氧烷之间的加成反应获得的共聚物。
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公开(公告)号：US4701482A
公开(公告)日：1987-10-20
申请号：US865416
申请日：1986-05-21
CPC分类号： H01L23/293 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要翻译： 提出了适用于半导体器件封装的基于环氧树脂的组合物。 除了可热固化的环氧树脂和无机填料之外，树脂组合物还可以通过其中独特的成分提供高度抗裂纹形成的固化树脂封装，该无机填料是具有被烃基取代的烃基的有机聚硅氧烷的组合 某些功能组，例如 缩水甘油基，氨基，巯基等，以及由聚合芳族部分的链段和有机聚硅氧烷部分的链段组成的嵌段共聚物。
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5.发明授权Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device 失效半导体封装阻燃环氧树脂组合物和半导体器件公开(公告)号：US06783859B2
公开(公告)日：2004-08-31
申请号：US10358188
申请日：2003-02-05
IPC分类号： B32B2738
CPC分类号： C08G59/621 , C08K3/04 , C08K3/10 , C08K3/36 , C08K5/5399 , C08K5/5419 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.
摘要翻译： 包含环氧树脂，酚醛树脂固化剂，无机填料，无机载体上的钼酸锌和两种磷腈化合物的互补组合的环氧树脂组合物是有效的可模塑的，阻燃的并且适用于半导体封装。 用固化的环氧树脂组合物封装的半导体器件的阻燃性和防潮可靠性得到改善。
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公开(公告)号：US6001901A
公开(公告)日：1999-12-14
申请号：US993867
申请日：1997-12-18
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.
摘要翻译： 包含环氧树脂，固化剂和无机填料的环氧树脂组合物在175℃下的熔融粘度至多为150泊。无机填料的BET比表面积为1.5-6m 2 / g，为 当以0.6 /秒的剪切速率测量无机填料和双酚F型液体环氧树脂的75/25混合物的粘度时。 和10 /秒。 通过E型粘度计在25 +/- 0.05℃的温度下，粘度在0.6 /秒的比例。 以10 /秒的粘度。 至少为3.5 / 1。 无机填料的加入量为组合物重量的80-90％。 该组合物适用于矩阵框架的封装。
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公开(公告)号：US5935314A
公开(公告)日：1999-08-10
申请号：US919344
申请日：1997-08-28
IPC分类号： C08K3/00 , C08K7/16 , C08K7/18 , C08L63/00 , C09C1/30 , C09C3/04 , H01L23/29 , H01L23/31 , C04B14/00
CPC分类号： H01L23/295 , C08K7/18 , C09C1/3009 , C09C3/04 , C01P2004/32 , C01P2004/61 , C01P2006/12 , C01P2006/22 , C01P2006/80 , H01L2924/0002 , Y10T428/12528
摘要： By removing a fraction of fine particles having a particle size of less than 2 .mu.m from starting inorganic filler particles having a mean particle size of 10-50 .mu.m and adding thereto particles having a mean particle size of 0.1-2 .mu.m and a specific surface area of 3-10 m.sup.2 /g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 .mu.m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.
摘要翻译： 通过从平均粒径为10-50μm的起始无机填料颗粒中除去一小部分粒径小于2μm的细颗粒，并加入平均粒度为0.1-2μm的颗粒和 比表面积为3-10m2 / g（BET），得到平均粒径为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。
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8.发明授权Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith 失效萘酚酚醛环氧树脂组合物和用其封装的半导体器件
公开(公告)号：US5358980A
公开(公告)日：1994-10-25
申请号：US181540
申请日：1994-01-14
IPC分类号： C08G59/14 , C08G59/32 , C08L63/00 , H01B3/40 , C08L61/06 , C08K3/22 , C08K3/28 , C08L61/08 , C08L61/12
CPC分类号： H01B3/40 , C08G59/145 , C08G59/3218 , C08L63/00
摘要： A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.
摘要翻译： 一种热固性树脂组合物，其包含（A）含有1-10重量％的缩水甘油基萘酚衍生物的含萘环的环氧树脂，（B）含有1至10重量％的萘酚衍生物的含萘环的酚醛树脂， 和（C）无机填料，其中萘酚衍生物的含量相对于总树脂成分为1〜5重量％适合于包封半导体器件，因为该组合物具有良好的成型性，并且固化成具有低系数 膨胀，耐热性和低吸湿性。
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公开(公告)号：US5225484A
公开(公告)日：1993-07-06
申请号：US798750
申请日：1991-11-27
IPC分类号： C08G59/62 , C08G59/00 , C08G59/02 , C08G59/14 , C08G59/18 , C08G59/32 , C08G59/40 , C08K5/5425 , C08L63/00 , C08L101/00 , H01L23/29 , H01L23/31
CPC分类号： C08L63/00 , C08G59/02 , C08G59/1444 , C08G59/3218 , C08L101/00
摘要： A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.
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10.发明授权Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith 失效含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
公开(公告)号：US5166228A
公开(公告)日：1992-11-24
申请号：US739447
申请日：1991-08-02
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/08 , C08G59/20 , C08G59/32 , C08L63/00 , C08L63/04 , C08L83/05 , H01B3/40 , H01L23/29 , H01L23/31
摘要： An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
摘要翻译： 包含（A）特定环氧树脂，（B）在分子中具有至少一个萘环的酚醛树脂和（C）无机填料的环氧树脂组合物具有改善的流动性并固化成具有低膨胀系数的产品， 高Tg，低吸湿性。 该组合物适用于封装半导体器件。
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