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公开(公告)号：US4902732A
公开(公告)日：1990-02-20
申请号：US928654
申请日：1986-11-05
摘要： The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.
摘要翻译： 本发明提供一种适用于半导体器件的封装树脂组合物的新型环氧树脂类固化性组合物，能够通过固化而具有低内应力的高裂纹形成，并具有非常高的导热性和保持高的玻璃化转变温度 。 本发明的组合物包含（a）100重量份作为环氧树脂和其固化剂的混合物的可固化环氧树脂共混物，（b）5至100重量份的由至少一种 芳族聚合物部分的段，苯基酚醛清漆和至少一个具有30-200个硅原子的有机聚硅氧烷部分，并通过碳 - 硅键连接到芳族聚合物部分，和任选地（c）无机填料， 优选为不超过1000重量份的二氧化硅填料，例如石英粉末。
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公开(公告)号：US5053445A
公开(公告)日：1991-10-01
申请号：US397739
申请日：1989-08-23
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
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公开(公告)号：US4877822A
公开(公告)日：1989-10-31
申请号：US179538
申请日：1988-04-08
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要翻译： 一种环氧树脂组合物，其包含可固化环氧树脂，固化剂，无机填料和至少一种共聚物，所述共聚物选自通过在含有一个或多个环氧基和一个或多个烯基的芳族聚合物之间的加成反应获得的共聚物， 有机聚硅氧烷; 通过含有一个或多个环氧基的芳族聚合物与特定含氨基的有机聚硅氧烷之间的加成反应获得的共聚物。
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公开(公告)号：US4701482A
公开(公告)日：1987-10-20
申请号：US865416
申请日：1986-05-21
CPC分类号： H01L23/293 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要翻译： 提出了适用于半导体器件封装的基于环氧树脂的组合物。 除了可热固化的环氧树脂和无机填料之外，树脂组合物还可以通过其中独特的成分提供高度抗裂纹形成的固化树脂封装，该无机填料是具有被烃基取代的烃基的有机聚硅氧烷的组合 某些功能组，例如 缩水甘油基，氨基，巯基等，以及由聚合芳族部分的链段和有机聚硅氧烷部分的链段组成的嵌段共聚物。
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公开(公告)号：US4876298A
公开(公告)日：1989-10-24
申请号：US201439
申请日：1988-06-02
申请人： Kunio Itoh , Toshio Shiobara
发明人： Kunio Itoh , Toshio Shiobara
CPC分类号： C08G59/1433 , C08G8/28 , C08L63/00 , Y10S525/922
摘要： An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.
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6.发明授权Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer 失效环氧树脂组合物和包封聚马来酰亚胺和（烯丙基 - 环氧）酚醛清漆/硅氧烷接枝共聚物的半导体器件
公开(公告)号：US5006614A
公开(公告)日：1991-04-09
申请号：US373286
申请日：1989-06-29
申请人： Kunio Itoh , Toshio Shiobara , Koji Futatsumori
发明人： Kunio Itoh , Toshio Shiobara , Koji Futatsumori
IPC分类号： C09K3/10 , C08G59/00 , C08G59/08 , C08G59/14 , C08G59/40 , C08L63/00 , C08L63/04 , C08L79/08 , C08L83/10 , C09D5/03 , C09D5/46 , C09D103/04 , C09D163/00 , H01L23/29 , H01L23/31
摘要： A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.
摘要翻译： 可固化环氧树脂与（a）含烯基的环氧化酚醛清漆树脂/有机聚硅氧烷共聚物和（b）除了固化剂和无机填料之外的聚酰亚胺树脂共混。 所得到的环氧树脂组合物可以在无湿度条件下甚至在潮湿条件下都不会发生裂纹。 它适用于半导体器件的封装以及模制和粉末涂层。
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公开(公告)号：US06680081B2
公开(公告)日：2004-01-20
申请号：US10102846
申请日：2002-03-22
申请人： Motoo Fukushima , Kunio Itoh , Shigeru Mori , Masaki Kasashima , Yoshitaka Hamada , Mikio Aramata
发明人： Motoo Fukushima , Kunio Itoh , Shigeru Mori , Masaki Kasashima , Yoshitaka Hamada , Mikio Aramata
IPC分类号： C23C1832
CPC分类号： H01B1/22 , H05K3/323 , Y10T428/2991 , Y10T428/2993 , Y10T428/2995 , Y10T428/2996
摘要： A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a stronger bond between the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.
摘要翻译： 在每个颗粒的表面上具有有机硅聚合物层的导电粉末和包围硅聚合物层的金属层即使在升高的温度下也具有更强的颗粒基体和金属之间的结合，并表现出高且稳定的导电性和耐热性。
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8.发明授权Low operating current and low noise semiconductor laser device for optical disk memories 失效用于光盘存储器的低工作电流和低噪声半导体激光器件
公开(公告)号：US5386429A
公开(公告)日：1995-01-31
申请号：US40655
申请日：1993-03-31
申请人： Hiroki Naito , Masahiro Kume , Hideyuki Sugiura , Toru Takayama , Kunio Itoh , Issei Ohta , Hirokazu Shimizu
发明人： Hiroki Naito , Masahiro Kume , Hideyuki Sugiura , Toru Takayama , Kunio Itoh , Issei Ohta , Hirokazu Shimizu
CPC分类号： B82Y20/00 , H01S5/2231 , H01S5/2004 , H01S5/2013 , H01S5/221 , H01S5/3211 , H01S5/32308 , H01S5/3432
摘要： A semiconductor laser device suitable as a light source for an optical disk may be operated at a low operating current with low noise for the 780 nm band. The device comprises: a certain conduction type Ga.sub.1-Y1 Al.sub.Y1 As first light guide layer, a Ga.sub.1-Y2 Al.sub.Y2 As second light guide layer of said certain conduction type, or an In.sub.0.5 Ga.sub.0.5 P or an In.sub.0.5 (GaAl).sub.0.5 P or an InGaAsP second light guide layer, successively formed one upon another at least in one side of the principal plane of an active layer; an opposite conduction type Ga.sub.1-Z Al.sub.Z As current blocking layer formed on the second light guide layer and provided with a stripe-like window; and a Ga.sub.1-Y3 Al.sub.Y3 As cladding layer of the same conduction type as the light guide layers formed on the stripe-like window. The relations of Z>Y3>Y2 and Y1>Y2 define the AlAs mole fractions.
摘要翻译： 适合作为光盘的光源的半导体激光器装置可以在780nm波段的低噪声的低工作电流下工作。 该装置包括：一定导电型Ga1-Y1AlY1As第一导光层，具有所述一定导电类型的Ga1-Y2AlY2As第二导光层，或In0.5Ga0.5P或In0.5（GaAl）0.5P或InGaAsP 第二导光层，在有源层的主平面的至少一个侧面依次形成; 形成在第二导光层上并具有条状窗的相反导电型Ga1-ZAlZAs电流阻挡层; 以及与形成在条状窗上的导光层相同的导电类型的Ga1-Y3AlY3As包覆层。 Z> Y3> Y2和Y1> Y2的关系定义了AlAs摩尔分数。
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公开(公告)号：US5086127A
公开(公告)日：1992-02-04
申请号：US472110
申请日：1990-01-30
申请人： Kunio Itoh , Mitsuo Umemura , Eiichi Tabei
发明人： Kunio Itoh , Mitsuo Umemura , Eiichi Tabei
IPC分类号： A61K8/00 , A61K8/89 , A61K8/891 , A61K8/892 , A61K8/895 , A61Q17/04 , C08G77/20 , C08G77/48 , C08G77/50 , C08J3/02 , C08L83/04 , C08L83/07 , C08L83/14 , C09K3/00
摘要： Organic silicon compounds comprising in the molecule thereof, a polysilane structural unit: -(R.sup.1 R.sup.2 Si).sub.n - and a structural unit: R.sup.3.sub.a SiO.sub.(4-a)/2 absorb UV in the range of 300-400 nm and are well soluble in organic solvent. These compounds are useful UV absorbers for cosmetic compositions.
摘要翻译： 在其分子中包含聚硅烷结构单元的有机硅化合物： - （R 1 R 2 Si）n和结构单元：R 3aaO（4-a）/ 2吸收范围为300-400nm的紫外线，并且很好地溶于有机溶剂 。 这些化合物是用于化妆品组合物的有用的紫外线吸收剂。
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公开(公告)号：US5068866A
公开(公告)日：1991-11-26
申请号：US428517
申请日：1989-10-30
申请人： Masaru Wada , Kunio Itoh
发明人： Masaru Wada , Kunio Itoh
CPC分类号： H01S5/028 , H01L24/97 , H01S5/02244 , H01L2224/48091 , H01L2224/48247 , H01L2924/12042 , H01L2924/12043 , H01S5/02212 , H01S5/02228 , H01S5/02248 , H01S5/0683
摘要： A laser chip is directly disposed on a support member through a mounting arrangement and a support member, the laser chip, and peripheral parts thereof are integrally sealed within a transparent plastic resin. In this structure, without requiring expensive materials and parts, a semiconductor laser apparatus may be manufactured by using the same materials and process as in the ordinary plastic-sealed LED, so that the cost may be reduced significantly.
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