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公开(公告)号：US20140042599A1
公开(公告)日：2014-02-13
申请号：US13584015
申请日：2012-08-13
申请人： Chung-Lin Wu , Steven Sapp , Bigildis Dosdos , Suresh Belani , Sunggeun Yoon
发明人： Chung-Lin Wu , Steven Sapp , Bigildis Dosdos , Suresh Belani , Sunggeun Yoon
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/16 , H01L29/4236 , H01L29/42372 , H01L29/7813 , H01L29/7828 , H01L2224/13147 , H01L2224/16245 , H01L2224/48137 , H01L2224/48247 , H01L2924/13091 , H01L2924/15747 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： The multi-chip leadless module 200 has integrated circuit (IC) 150, dual re-channel mosfet 110, IC leads 210, 211, 212, gate leads 213, 213, and source leads 217-220 encapsulated in resin 250. The IC 150 and the dual n-channel mosfet 110 are mounted face down on the leads. IC leads 210, 211, 212 are made of planar metal and connect, respectively, to the electrodes TEST, VDD and VM on the IC 150 using a flip chip technique to assemble the leads on copper pillars or copper studs.
摘要翻译： 多芯片无引线模块200具有集成电路（IC）150，双重信道mosfet 110，IC引线210,211,212，栅极引线213,213和封装在树脂250中的源极引线217-220。IC 150 并且双n沟道MOSFET 110面朝下安装在引线上。 IC引线210,211,212由平面金属制成，并且使用倒装芯片技术分别连接到IC 150上的电极TEST，VDD和VM，以将铜柱或铜螺柱上的引线组装。
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公开(公告)号：US08723300B2
公开(公告)日：2014-05-13
申请号：US13584015
申请日：2012-08-13
申请人： Chung-Lin Wu , Steven Sapp , Bigildis Dosdos , Suresh Belani , Sunggeun Yoon
发明人： Chung-Lin Wu , Steven Sapp , Bigildis Dosdos , Suresh Belani , Sunggeun Yoon
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/16 , H01L29/4236 , H01L29/42372 , H01L29/7813 , H01L29/7828 , H01L2224/13147 , H01L2224/16245 , H01L2224/48137 , H01L2224/48247 , H01L2924/13091 , H01L2924/15747 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： The multi-chip leadless module 200 has integrated circuit (IC) 150, dual n-channel mosfet 110, IC leads 210, 211, 212, gate leads 213, 213, and source leads 217-220 encapsulated in resin 250. The IC 150 and the dual n-channel mosfet 110 are mounted face down on the leads. IC leads 210, 211, 212 are made of planar metal and connect, respectively, to the electrodes TEST, VDD and VM on the IC 150 using a flip chip technique to assemble the leads on copper pillars or copper studs.
摘要翻译： 多芯片无引线模块200具有封装在树脂250中的集成电路（IC）150，双n沟道MOSFET 110，IC引线210,211,212，栅极引线213,213和源极引线217-220。IC 150 并且双n沟道MOSFET 110面朝下安装在引线上。 IC引线210,211,212由平面金属制成，并且使用倒装芯片技术分别连接到IC 150上的电极TEST，VDD和VM，以将铜柱或铜螺柱上的引线组装。
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公开(公告)号：US20070264562A1
公开(公告)日：2007-11-15
申请号：US11616641
申请日：2006-12-27
申请人： Dongha KANG , SungGeun YOON , Jaesik CHUNG
发明人： Dongha KANG , SungGeun YOON , Jaesik CHUNG
IPC分类号： H01M2/10
CPC分类号： H01M2/1077 , H01M2/105 , H01M10/425 , H01M2200/00
摘要： Disclosed herein are a frame member including an upper frame member having one major surface to which a protection circuit module (PCM) is mounted, and a lower frame member coupled with the upper frame member, the upper and lower frame members being provided at opposite major surfaces thereof with semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical unit cells mounted between the upper and lower frame members, a spacer provided at opposite major surfaces of a rectangular frame with pluralities of semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical batteries, the battery receiving parts being partially open such that the battery receiving parts communicate with neighboring battery receiving parts on the same plane, and a battery pack including the frame member and the spacer.
摘要翻译： 这里公开了一种框架构件，其包括具有安装有保护电路模块（PCM）的一个主表面的上框架构件和与上框架构件联接的下框架构件，上框架构件和下框架构件设置在相对的主要构件 其表面具有对应于安装在上框架构件和下框架构件之间的圆筒形单元的外表面的半圆柱形电池接收部件，设置在矩形框架的相对主表面处的间隔件，其具有多个对应于外部框架的半圆柱形电池接收部件 圆柱形电池的表面，电池接收部分部分打开，使得电池接收部分与相同平面上的相邻电池接收部分连通，以及包括框架部件和间隔件的电池组。
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公开(公告)号：US08114537B2
公开(公告)日：2012-02-14
申请号：US13084636
申请日：2011-04-12
申请人： Dongha Kang , SungGeun Yoon , Jaesik Chung
发明人： Dongha Kang , SungGeun Yoon , Jaesik Chung
IPC分类号： H01M2/10
CPC分类号： H01M2/1077 , H01M2/105 , H01M10/425 , H01M2200/00
摘要： Disclosed herein are a frame member including an upper frame member having one major surface to which a protection circuit module (PCM) is mounted, and a lower frame member coupled with the upper frame member, the upper and lower frame members being provided at opposite major surfaces thereof with semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical unit cells mounted between the upper and lower frame members, a spacer provided at opposite major surfaces of a rectangular frame with pluralities of semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical batteries, the battery receiving parts being partially open such that the battery receiving parts communicate with neighboring battery receiving parts on the same plane, and a battery pack including the frame member and the spacer.
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公开(公告)号：US20110189509A1
公开(公告)日：2011-08-04
申请号：US13084636
申请日：2011-04-12
申请人： Dongha KANG , SungGeun YOON , Jaesik CHUNG
发明人： Dongha KANG , SungGeun YOON , Jaesik CHUNG
IPC分类号： H01M10/42
CPC分类号： H01M2/1077 , H01M2/105 , H01M10/425 , H01M2200/00
摘要： Disclosed herein are a frame member including an upper frame member having one major surface to which a protection circuit module (PCM) is mounted, and a lower frame member coupled with the upper frame member, the upper and lower frame members being provided at opposite major surfaces thereof with semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical unit cells mounted between the upper and lower frame members, a spacer provided at opposite major surfaces of a rectangular frame with pluralities of semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical batteries, the battery receiving parts being partially open such that the battery receiving parts communicate with neighboring battery receiving parts on the same plane, and a battery pack including the frame member and the spacer.
摘要翻译： 这里公开了一种框架构件，其包括具有安装有保护电路模块（PCM）的一个主表面的上框架构件和与上框架构件联接的下框架构件，上框架构件和下框架构件设置在相对的主要构件 其表面具有对应于安装在上框架构件和下框架构件之间的圆筒形单元的外表面的半圆柱形电池接收部件，设置在矩形框架的相对主表面处的间隔件，其具有多个对应于外部框架的半圆柱形电池接收部件 圆柱形电池的表面，电池接收部分部分打开，使得电池接收部分与相同平面上的相邻电池接收部分连通，以及包括框架部件和间隔件的电池组。
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公开(公告)号：US08114536B2
公开(公告)日：2012-02-14
申请号：US11616641
申请日：2006-12-27
申请人： Dongha Kang , SungGeun Yoon , Jaesik Chung
发明人： Dongha Kang , SungGeun Yoon , Jaesik Chung
IPC分类号： H01M2/10
CPC分类号： H01M2/1077 , H01M2/105 , H01M10/425 , H01M2200/00
摘要： Disclosed herein are a frame member including an upper frame member having one major surface to which a protection circuit module (PCM) is mounted, and a lower frame member coupled with the upper frame member, the upper and lower frame members being provided at opposite major surfaces thereof with semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical unit cells mounted between the upper and lower frame members, a spacer provided at opposite major surfaces of a rectangular frame with pluralities of semi-cylindrical battery receiving parts corresponding to outer surfaces of the cylindrical batteries, the battery receiving parts being partially open such that the battery receiving parts communicate with neighboring battery receiving parts on the same plane, and a battery pack including the frame member and the spacer.
摘要翻译： 这里公开了一种框架构件，其包括具有安装有保护电路模块（PCM）的一个主表面的上框架构件和与上框架构件联接的下框架构件，上框架构件和下框架构件设置在相对的主要构件 其表面具有对应于安装在上框架构件和下框架构件之间的圆筒形单元的外表面的半圆柱形电池接收部件，设置在矩形框架的相对主表面处的间隔件，其具有多个对应于外部框架的半圆柱形电池接收部件 圆柱形电池的表面，电池接收部分部分打开，使得电池接收部分与相同平面上的相邻电池接收部分连通，以及包括框架部件和间隔件的电池组。
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