Control system for ablating high-density array of vias or indentation in surface of object
    1.
    发明授权
    Control system for ablating high-density array of vias or indentation in surface of object 失效
    用于消除物体表面高密度阵列通孔或压痕的控制系统

    公开(公告)号:US06420675B1

    公开(公告)日:2002-07-16

    申请号:US09540366

    申请日:2000-03-31

    IPC分类号: B23K2606

    摘要: An control system for controlling movement of a product to be imaged relative to a laser and operation of a laser. The control system comprises a mechanism for obtaining drill position data from a data storage device. The control system further includes a mechanism for simultaneously sending necessary signals to alter a path of a laser beam emitted by the laser relative to the object to be imaged. The control system further includes a mechanism for providing a feedback to indicate that the path laser beam, from the laser to the product to be imaged, is suitably altered. The control system further includes a mechanism for firing the laser beam for one of burning, drilling or forming a desired formation in a surface of the object to be imaged. The control system further includes a mechanism for returning the control system, when necessary, for reading further drill position data from the data storage device.

    摘要翻译: 一种用于控制相对于激光成像的产品的运动和激光的操作的控制系统。 控制系统包括用于从数据存储装置获取钻头位置数据的机构。 控制系统还包括一个机构,用于同时发送必要的信号以改变由激光器发射的激光束相对于待成像对象的路径。 控制系统还包括用于提供反馈以指示从激光到要成像的产品的路径激光束被适当改变的机构。 所述控制系统还包括用于对所述被成像体的表面进行燃烧,钻孔或形成期望的地层的激光束的点火的机构。 控制系统还包括用于在需要时返回控制系统用于从数据存储装置读取更多钻头位置数据的机构。