INTEGRATED CIRCUIT
    1.
    发明申请

    公开(公告)号:US20250063827A1

    公开(公告)日:2025-02-20

    申请号:US18940498

    申请日:2024-11-07

    Abstract: An integrated circuit includes first to second transistors and a resistive device. The first transistor is coupled between a pad and a first voltage terminal that provides a first supply voltage. The second transistor is coupled in parallel with the first transistor. A breakdown voltage of the first transistor is different from a trigger voltage of the second transistor. The resistive device is coupled between the pad and a second voltage terminal that provides a second supply voltage higher than the first supply voltage, and operates with the second supply voltage in an electrostatic discharge (ESD) event when the first and second transistors discharge a ESD current between the pad and the first voltage terminal.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250058128A1

    公开(公告)日:2025-02-20

    申请号:US18935150

    申请日:2024-11-01

    Inventor: Zheng-Long CHEN

    Abstract: A semiconductor device includes substrate, a first gate structure, a second gate structure, and an epitaxy layer. The first gate structure and the second gate structure are over the substrate, in which the first gate structure and the second gate structure each comprises a shielding electrode, a gate electrode over the shielding electrode, and a first gate dielectric layer vertically separating the shielding electrode from the gate electrode. The epitaxy layer is over the substrate and cups an underside of the first gate structure and the second gate structure, in which the epitaxy layer comprises a doped region laterally between the first gate dielectric layer of the first gate structure and the first gate dielectric layer of the second gate structure, a dopant concentration of the doped region being non-uniform along a lateral direction.

    METHOD OF OPERATING CIRCUIT, AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20240387508A1

    公开(公告)日:2024-11-21

    申请号:US18785893

    申请日:2024-07-26

    Abstract: A method includes receiving a first power voltage at a gate and first terminal of a first transistor having a second terminal connected to a first node, the first power being gated to provide voltage in a first or a second state; receiving a voltage at a gate of a second transistor coupled between the first node and a ground node; receiving a second power voltage at a follower circuit coupled to the first node; turning on the second transistor to pull the first node toward ground, when the first power voltage is in the first state; turning off the second transistor when the first power voltage is in the second state; and discharging parasitic noise voltage of the first node through the first transistor during at least part of a period in which the first power voltage is in the second state and less than the second power voltage.

    Method of making an integrated circuit with drain well having multiple zones

    公开(公告)号:US12148827B2

    公开(公告)日:2024-11-19

    申请号:US17884872

    申请日:2022-08-10

    Inventor: Zheng Long Chen

    Abstract: A method of making an integrated circuit includes forming a drift region in a substrate, the drift region having a first dopant type; forming a drain well in the drift region, the drain well having the first dopant type. The drain well includes a first zone with a first concentration of the first dopant and a second zone having a second concentration of the first dopant different from the first concentration of the first dopant. The method further includes forming a source well in the substrate, the source well having a second dopant type opposite from the first dopant type, the source well being adjacent to the drift region in the substrate. The method includes forming a gate electrode over a top surface of the substrate over the drift region and the source well, and being laterally separated from the drain well. The method includes forming a drain low-density doped (LDD) region in the second zone of the drain well.

    SYSTEM AND METHOD FOR SEMICONDUCTOR FABRICATING PROCESS

    公开(公告)号:US20240241495A1

    公开(公告)日:2024-07-18

    申请号:US18188260

    申请日:2023-03-22

    CPC classification number: G05B19/188 G05B2219/45031

    Abstract: A method includes using a first pump apparatus to control a pressure condition of a first chamber, wherein the first pump apparatus produces a first operation data in a first digital protocol format; using a second pump apparatus to control a pressure condition of a second chamber, wherein the second pump apparatus produces a second operation data in a second digital protocol format different from the first digital protocol format; receiving, by a box device, the first operation data in the first digital protocol format and the second operation data in the second digital protocol format; decoding, by the box device, the first operation data in the first digital protocol format and the second operation data in the second digital protocol format; determining whether the first operation data is in an acceptable range; and adjusting the first pump apparatus to set the first operation data within the acceptable range.

    Method of making semiconductor device having buried bias pad

    公开(公告)号:US11973083B2

    公开(公告)日:2024-04-30

    申请号:US17741410

    申请日:2022-05-10

    Abstract: A method of making an integrated circuit includes surrounding a first bias pad with dielectric material of a buried oxide layer. The method includes adding dopants to a layer of semiconductor material over the first bias pad. The method includes depositing a gate dielectric and a gate electrode over a top surface of the layer of semiconductor material. The method includes etching the gate dielectric and the gate electrode to isolate a gate electrode over the layer of semiconductor material. The method includes depositing an inter layer dielectric (ILD) material over the gate electrode and the layer of semiconductor material. The method includes etching at least one bias contact opening down to the first bias pad. The method includes filling the at least one bias contact opening with a bias contact material. The method includes electrically connecting at least one bias contact to an interconnect structure of the semiconductor device.

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