Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer
    3.
    发明申请
    Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer 审中-公开
    自动停止用于抛光高阶高氧化物层的磨料组合物

    公开(公告)号:US20110045741A1

    公开(公告)日:2011-02-24

    申请号:US11912849

    申请日:2006-04-28

    CPC classification number: C09K3/1463 C09G1/02 H01L21/31053

    Abstract: Disclosed is a chemical-mechanical polishing composition used in a process for chemical-mechanical polishing of silicon oxide layer having severe unevenness with large step-height. The composition includes abrasive particles of metal oxide; and at least one compound(s) selected from the group consisting of amino alcohols, hydroxycarboxylic acid having at least 3 of the total number of carboxylic acid group(s) and hydroxyl group(s) or their salts, or a mixture thereof. A polymeric organic acid, a preservative, a lubricant and a surfactant may be further contained. The composition shortens the vapor-deposition time of a layer to be polished, saves the raw material to be vapor-deposited, shortens the chemical-mechanical polishing time, and saves the slurry employed.

    Abstract translation: 公开了一种化学机械抛光组合物,其用于具有大步长严重不均匀性的氧化硅层的化学机械抛光方法。 该组合物包括金属氧化物的磨料颗粒; 和至少一种选自氨基醇,具有至少3个羧基基团和羟基或其盐的羟基羧酸或其混合物的化合物。 还可以含有聚合有机酸,防腐剂,润滑剂和表面活性剂。 该组合物缩短了待抛光层的气相沉积时间,节省了原料蒸汽沉积,缩短了化学机械抛光时间,节省了所用浆料。

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