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1.发明申请Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it 有权具有高导热性的烧结金刚石及其制造方法以及使用它的散热器公开(公告)号：US20050051891A1
公开(公告)日：2005-03-10
申请号：US10494947
申请日：2002-10-16
IPC分类号： C04B35/645 , H01L23/373 , H01L23/34
CPC分类号： C04B35/645 , C04B35/52 , C04B35/62842 , C04B2235/3817 , C04B2235/3826 , C04B2235/3839 , C04B2235/404 , C04B2235/405 , C04B2235/407 , C04B2235/427 , C04B2235/428 , C04B2235/723 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/9607 , H01L23/3732 , H01L2924/0002 , H01S5/02476 , Y10S438/929 , Y10T428/26 , Y10T428/2982 , Y10T428/30 , H01L2924/00
摘要： This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.
摘要翻译： 本发明涉及一种高导热性复合材料，其包括金刚石颗粒和铜基质，其可用作用于电子部件的电子散热器，特别是用于半导体激光器，高性能MPU（微处理单元）等），还涉及用于 相同的生产和散热器使用相同。 根据本发明的高导热性金刚石烧结体，特别地，可以提供具有高导热性以及热膨胀匹配的散热器，最适合于安装大型和高热负荷半导体芯片 ，例如高输出半导体激光器，高性能MPU等。此外，可以自由地控制热导率和热膨胀等性能，因此可以根据元件的特征和设计来选择最合适的散热器 要安装。
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2.发明授权Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it 有权具有高导热性的烧结金刚石及其制造方法以及使用它的散热器公开(公告)号：US07528413B2
公开(公告)日：2009-05-05
申请号：US10494947
申请日：2002-10-16
IPC分类号： H01L29/15 , H01L31/0312
CPC分类号： C04B35/645 , C04B35/52 , C04B35/62842 , C04B2235/3817 , C04B2235/3826 , C04B2235/3839 , C04B2235/404 , C04B2235/405 , C04B2235/407 , C04B2235/427 , C04B2235/428 , C04B2235/723 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/9607 , H01L23/3732 , H01L2924/0002 , H01S5/02476 , Y10S438/929 , Y10T428/26 , Y10T428/2982 , Y10T428/30 , H01L2924/00
摘要： This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.
摘要翻译： 本发明涉及一种高导热性复合材料，其包括金刚石颗粒和铜基质，其可用作用于电子部件的电子散热器，特别是用于半导体激光器，高性能MPU（微处理单元）等），还涉及用于 相同的生产和散热器使用相同。 根据本发明的高导热性金刚石烧结体，特别地，可以提供具有高导热性以及热膨胀匹配的散热器，最适合于安装大型和高热负荷半导体芯片 ，例如高输出半导体激光器，高性能MPU等。此外，可以自由地控制热导率和热膨胀等性能，因此可以根据元件的特征和设计来选择最合适的散热器 要安装。
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