MULTILAYER ELECTRONIC COMPONENT
    8.
    发明公开

    公开(公告)号:US20240212934A1

    公开(公告)日:2024-06-27

    申请号:US18387659

    申请日:2023-11-07

    发明人: Sung Yong Kang

    摘要: A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.