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公开(公告)号:US5940267A
公开(公告)日:1999-08-17
申请号:US710279
申请日:1996-09-13
申请人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号: H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号: H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要: A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.
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公开(公告)号:US6067227A
公开(公告)日:2000-05-23
申请号:US246956
申请日:1999-02-09
申请人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号: H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号: H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要: A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.
摘要翻译: 一种安装在发热元件上的散热器,用于冷却安装在电子设备的印刷电路板上的发热元件,该发热元件具有由热导性材料制成的散热体和安装在散热体内部的风扇组件。 通过由风扇组件的旋转产生的冷却空气有效地对散热体进行空气冷却。 冷却空气强制地冷却基座和与发热元件相邻的基座的固定壁和板状散热片,或者在散热体上突出有销状的散热片,以有效地散热。 风扇组件的位置位于散热器主体的中心,或者位于散热器主体中心的偏移位置。 本发明的散热器可以安装在诸如便携式计算机的便携式电子设备中。
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公开(公告)号:US5650912A
公开(公告)日:1997-07-22
申请号:US478667
申请日:1995-06-07
申请人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号: H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号: H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要: A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.
摘要翻译: 一种安装在发热元件上的散热器,用于冷却安装在电子设备的印刷电路板上的发热元件,该发热元件具有由热导性材料制成的散热体和安装在散热体内部的风扇组件。 通过由风扇组件的旋转产生的冷却空气有效地对散热体进行空气冷却。 冷却空气强制地冷却基座和与发热元件相邻的基座的固定壁和板状散热片,或者在散热体上突出有销状的散热片,以有效地散热。 风扇组件的位置位于散热器主体的中心,或者位于散热器主体中心的偏移位置。 本发明的散热器可以安装在诸如便携式计算机的便携式电子设备中。
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公开(公告)号:US5504650A
公开(公告)日:1996-04-02
申请号:US433131
申请日:1995-05-03
申请人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人: Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号: H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号: H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要: A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.
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