公开(公告)号：US5283007A

公开(公告)日：1994-02-01

申请号：US874879

申请日：1992-04-28

申请人： Yasuo Yamamoto ,  Akira Inaba ,  Takayuki Oba

发明人： Yasuo Yamamoto ,  Akira Inaba ,  Takayuki Oba

IPC分类号： H01B1/22 ,  H05K1/09 ,  H01B1/00 ,  H01B1/02 ,  H01B1/06 ,  H01B1/08

CPC分类号： H01B1/22 ,  H05K1/095

摘要： An electrically conductive thick film resin composition comprising finely divided particles of (1) a conductive metal dispersed in a liquid organic medium comprising (2) acrylic polymer primary binder and (3) network resin auxiliary binder having a thermal degradation temperature of at least 300 C. dissolved in (4) volatile organic solvent.

摘要翻译： 一种导电性厚膜树脂组合物，其包含（1）分散在液体有机介质中的导电金属的细碎颗粒，所述液体有机介质包含（2）丙烯酸类聚合物主粘合剂和（3）热降解温度为至少300℃的网状树脂辅助粘合剂 溶于（4）挥发性有机溶剂。

公开(公告)号：US06379219B1

公开(公告)日：2002-04-30

申请号：US09577126

申请日：2000-05-24

申请人： Takayuki Oba

发明人： Takayuki Oba

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B49/003 ,  B24B49/045

摘要： At least two elastic wave sensors are disposed in contact with a workpiece such as a microstructure or an optical structure. Elastic waves generated during chemical mechanical polishing of the workpiece are monitored by using the elastic wave sensors. Chemical mechanical polishing conditions are set to achieve uniform chemical mechanical polishing, or an ending point of the chemical mechanical polishing is set based on the monitored signal by the elastic wave sensors, and a process is carried out for chemical mechanical polishing. By the process, a workpiece is polished uniformly to flatten steps in the workpiece or to flatten surface defects of a structure. Alternatively, by the process, a workpiece having a laminated structure is polished up to an interface of the laminated structure.

摘要翻译： 至少两个弹性波传感器设置成与诸如微结构或光学结构的工件接触。 通过使用弹性波传感器监测在工件的化学机械抛光期间产生的弹性波。 设置化学机械抛光条件以实现均匀的化学机械抛光，或者基于由弹性波传感器监测的信号来设置化学机械抛光的终点，并且进行化学机械抛光的工艺。 通过该过程，均匀地抛光工件以使工件中的台阶变平或使结构的表面缺陷变平。 或者，通过该处理，将具有层叠结构的工件研磨到层压结构体的界面。

公开(公告)号：US5670089A

公开(公告)日：1997-09-23

申请号：US568920

申请日：1995-12-07

申请人： Takayuki Oba ,  Akira Inaba

发明人： Takayuki Oba ,  Akira Inaba

IPC分类号： H01B1/16 ,  H01B1/02 ,  H01B1/22

CPC分类号： H01B1/16

摘要： The purpose of this invention is to provide a terminal electrode composition for a multiple-layered capacitor that is suitable for a plating base and that has improved resistance to heat stress as the result of sintering at a low temperature (high reliability). The terminal electrode composition for multiple-layered capacitor of this invention is made of precious metal particles and 0.5-7 wt. % (based on the weight-of the precious metal particles) of an inorganic binder having a 400.degree.-500.degree. C. glass transition point and a 400.degree.-550.degree. C. glass softening point.

摘要翻译： 本发明的目的是提供一种适用于电镀基底的多层电容器的端子电极组合物，并且由于低温烧结（高可靠性），耐热应力提高。 本发明的多层电容器用末端电极组合物由贵金属粒子和0.5〜7重量％ ％（基于贵重金属颗粒的重量）的无机粘合剂，其具有400-500℃的玻璃化转变点和400-550℃的玻璃软化点。