公开(公告)号：US06201260B1

公开(公告)日：2001-03-13

申请号：US09152253

申请日：1998-09-14

申请人： Mitsuaki Suzuki ,  Shinichi Kamagami ,  Takuji Nakazono

发明人： Mitsuaki Suzuki ,  Shinichi Kamagami ,  Takuji Nakazono

IPC分类号： H01L2976

CPC分类号： H01L29/78696 ,  H01L29/66757 ,  H01L29/78609

摘要： A thin film transistor of this invention has a structure obtained by sequentially stacking, on an insulating substrate, a silicon nitride film, a silicon oxide film, a polysilicon thin film with a channel region and source and drain regions facing each other via the channel region, an insulating film, and a gate electrode. The boron concentration decreases from the channel region toward the silicon nitride film in the silicon oxide film region between the channel region and the silicon nitride film. The silicon oxide film region between the channel region and the silicon nitride film is made up of a first region which is in contact with the channel region and has a boron concentration of 1×1016 atoms/cm3 or more, and a second region between the first region and the silicon nitride film, which has a boron concentration of less than 1×1016 atoms/cm3. The first region has a thickness of 200 Å or less.

公开(公告)号：US5260813A

公开(公告)日：1993-11-09

申请号：US666047

申请日：1991-03-07

申请人： Hajime Sato ,  Takuji Nakazono ,  Hiroki Nakamura

发明人： Hajime Sato ,  Takuji Nakazono ,  Hiroki Nakamura

IPC分类号： B41J2/345 ,  B41J2/34 ,  H01L27/146 ,  H04N1/028 ,  H04N1/031 ,  H04N1/032 ,  H04N1/04 ,  G01D15/10 ,  H01J40/14 ,  H04N5/335

CPC分类号： H04N1/0316 ,  B41J2/34 ,  H04N1/0313

摘要： In an image reading apparatus, first and second semiconductor chips are arranged in series on a transparent insulative base. The semiconductor chips are covered by a protective layer and have conductive pads located both side of the series arrangement of the chips. A traveling path in which a document passes is defined on the protective layer between the pads.

公开(公告)号：US5280304A

公开(公告)日：1994-01-18

申请号：US934271

申请日：1992-08-25

申请人： Hajime Sato ,  Takuji Nakazono ,  Hiroki Nakamura

发明人： Hajime Sato ,  Takuji Nakazono ,  Hiroki Nakamura

IPC分类号： B41J2/345 ,  B41J2/34 ,  H01L27/146 ,  H04N1/028 ,  H04N1/031 ,  H04N1/032 ,  G01D15/10 ,  H04N1/23

CPC分类号： H04N1/0316 ,  B41J2/34 ,  H04N1/0313

摘要： In an image reading apparatus, first and second semiconductor chips are arranged in series on a transparent insulative base. The semiconductor chips are covered by a protective layer and have conductive pads located both side of the series arrangement of the chips. A traveling path in which a document passes is defined on the protective layer between the pads.

摘要翻译： 在图像读取装置中，第一和第二半导体芯片串联布置在透明绝缘基底上。 半导体芯片由保护层覆盖，并且具有位于芯片的串联布置的两侧的导电焊盘。 文件通过的行进路径被限定在垫之间的保护层上。