公开(公告)号：US20070164073A1

公开(公告)日：2007-07-19

申请号：US11650503

申请日：2007-01-08

申请人： Yosuke Watanabe ,  Keiji Nomaru ,  Nobumori Ogoshi ,  Koichi Mitani ,  Taizo Kise ,  Kohei Matsumoto ,  Tatsuya Inaoka ,  Masaru Nakamura

发明人： Yosuke Watanabe ,  Keiji Nomaru ,  Nobumori Ogoshi ,  Koichi Mitani ,  Taizo Kise ,  Kohei Matsumoto ,  Tatsuya Inaoka ,  Masaru Nakamura

IPC分类号： B26F3/00 ,  B26F3/02

CPC分类号： B26F3/002 ,  B23K26/40 ,  B23K2103/50 ,  B26D7/10 ,  B28D5/0011 ,  B28D5/0052 ,  Y10T225/325

摘要： A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.

摘要翻译： 沿着格子状分割线将具有格子状分割线的晶片和在基板的前表面上的聚合物膜分割的方法，其被处理以允许沿着分割线分割，所述方法包括 框架保持步骤，用于将晶片放置在安装在环形框架上的胶带的表面上; 用于冷却固定到安装在环形框架上的胶带的表面的晶片的晶片冷却步骤; 以及用于通过使粘附有冷却晶片的粘合带膨胀而沿着分割线分割晶片的潜水步骤。

公开(公告)号：US07544587B2

公开(公告)日：2009-06-09

申请号：US11650503

申请日：2007-01-08

申请人： Yosuke Watanabe ,  Keiji Nomaru ,  Nobumori Ogoshi ,  Koichi Mitani ,  Taizo Kise ,  Kohei Matsumoto ,  Tatsuya Inaoka ,  Masaru Nakamura

发明人： Yosuke Watanabe ,  Keiji Nomaru ,  Nobumori Ogoshi ,  Koichi Mitani ,  Taizo Kise ,  Kohei Matsumoto ,  Tatsuya Inaoka ,  Masaru Nakamura

IPC分类号： H01L21/301

CPC分类号： B26F3/002 ,  B23K26/40 ,  B23K2103/50 ,  B26D7/10 ,  B28D5/0011 ,  B28D5/0052 ,  Y10T225/325

摘要： A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.

摘要翻译： 沿着格子状分割线将具有格子状分割线的晶片和在基板的前表面上的聚合物膜分割的方法，其被处理以允许沿着分割线分割，所述方法包括 框架保持步骤，用于将晶片放置在安装在环形框架上的胶带的表面上; 用于冷却固定到安装在环形框架上的胶带的表面的晶片的晶片冷却步骤; 以及用于通过使粘附有冷却晶片的粘合带膨胀而沿着分割线分割晶片的潜水步骤。