JOINING DEVICE FOR NON-POSITIVE JOINING BY MEANS OF A FILLER MATERIAL USING SENSORS
    1.
    发明申请
    JOINING DEVICE FOR NON-POSITIVE JOINING BY MEANS OF A FILLER MATERIAL USING SENSORS 审中-公开
    通过使用传感器的填充材料进行非积极加工的接合装置

    公开(公告)号:US20120267349A1

    公开(公告)日:2012-10-25

    申请号:US13499955

    申请日:2010-09-29

    IPC分类号: B23K26/06 B23K26/20

    摘要: A joining device for a bonded connection by means of a filler material has a feeding device for a wire as the filler material, which is configured to feed the wire during operation of the joining device at a predetermined speed of advance, and a guiding device for an energy beam with at least two partial beams for the melting of the wire. The joining device has a first measuring sensor for detecting a lateral deflection of the wire and a second measuring sensor for detecting a quantity related to the advancement of the wire, wherein the guiding device for the energy beam is connected to the first and the second measuring sensor and configured such that the energy beam is deflected and/or focused in dependence on the output signals of the first and second measuring sensor.

    摘要翻译: 用于通过填充材料进行粘合连接的接合装置具有用于线作为填充材料的馈送装置,其被配置为以预定的速度在接合装置的操作期间馈送线;以及引导装置, 具有至少两个用于熔化线的部分光束的能量束。 接合装置具有用于检测线的横向偏转的第一测量传感器和用于检测与线的前进相关的量的第二测量传感器,其中能量束的引导装置连接到第一和第二测量 传感器并且被配置为使得能量束根据第一和第二测量传感器的输出信号被偏转和/或聚焦。