摘要:
The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.
摘要:
A method and system for accurately determining the location of the mobile device (10) is disclosed. In the mapping phase collected reference positioning data and collected cell data are used to map a covered area estimation and in the actual location determination phase the covered area estimation is calculated from actual environment data received through wireless cellular communication network (11, 12) and possibly but not necessarily from external databases (17, 19). The covered area estimation comprises at least some of the following calculations: (i) estimation of base station location, (ii) estimation of transmission range, (iii) estimation of signal map and (iv) estimation of area type. The actual location of the mobile device (10) is determined from the covered area estimation based on relative comparison between the actual environment data and estimations (i)-(iv) and weight numbers resulted from the comparison. During the both phases a database is stored in the server (14) and updated whenever new environment data is received.
摘要:
The invention relates to a post formable plywood product and method for manufacturing a post formable plywood product. The post formable plywood product is formed so that the veneers of the plywood are joined together. In accordance with the invention, the veneers are bound together by self-adhesive material formed of polyolefm film, and polyolefin film contains reactive groups with —OH groups of the wood for forming covalent bonds between the veneer and polyolefin film.