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公开(公告)号:US20100243830A1
公开(公告)日:2010-09-30
申请号:US12707108
申请日:2010-02-17
Applicant: Yi-Ting Chen , Chin-Wei Chuang , Skay Lin , Li-Yen Wang , Kuan-Ting Chen
Inventor: Yi-Ting Chen , Chin-Wei Chuang , Skay Lin , Li-Yen Wang , Kuan-Ting Chen
IPC: F16M11/04
Abstract: An electronic device includes a body and a stand. The body has a fastening structure. The stand is used to support the body and dispose the body at a plane. The stand has a curved surface, and a locating portion is disposed at the curved surface. The body and the plane are contacted with the curved surface at the same time. The body is located at a first position of the locating portion by the fastening structure. When a force is applied to the body, the locating portion is rotated to drive the stand to rotate. Thus, the fastening structure is located at a second position of the locating portion, and an angle between the body and the plane is adjusted.
Abstract translation: 电子设备包括主体和支架。 身体有紧固结构。 支架用于支撑身体并将身体处置在飞机上。 支架具有弯曲表面,并且定位部分设置在弯曲表面处。 身体和平面同时与曲面接触。 主体通过紧固结构位于定位部分的第一位置。 当力施加到身体时,定位部分被旋转以驱动支架旋转。 因此,紧固结构位于定位部的第二位置,并且调整主体和平面之间的角度。
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公开(公告)号:US20100240239A1
公开(公告)日:2010-09-23
申请号:US12707141
申请日:2010-02-17
Applicant: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
Inventor: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
IPC: H01R13/44
CPC classification number: H01R13/5213 , G06F1/1616 , G06F1/1656 , G06F1/1675 , H01R2201/06
Abstract: An electronic device with a hidden I/O interface module is disclosed. The electronic device includes a container and a surface with an opening, container and the opening communicate with each other. The container includes a first position and a second position. The electronic device also includes an I/O connection unit, a pivot module and a cover. The I/O connection unit is disposed at the container, electrically connected to the electronic device and includes a connecting surface. The pivot module is connected to the I/O connection unit. The cover is connected to the pivot module. When the cover is shut, it covers the container and makes the I/O connection unit located at the first position. When the cover is open, it drives the pivot module to drive the I/O connection unit to move to the second position to make the connecting surface of the I/O connection unit aligned with the surface.
Abstract translation: 公开了具有隐藏I / O接口模块的电子设备。 电子装置包括容器和具有开口,容器和开口彼此连通的表面。 容器包括第一位置和第二位置。 电子设备还包括I / O连接单元,枢轴模块和盖。 I / O连接单元设置在容器上,电连接到电子设备并且包括连接表面。 枢轴模块连接到I / O连接单元。 盖子连接到枢轴模块。 当盖子关闭时,它盖住容器并使I / O连接单元位于第一位置。 当盖子打开时,它驱动枢轴模块以驱动I / O连接单元移动到第二位置,以使I / O连接单元的连接表面与表面对齐。
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公开(公告)号:US20110104917A1
公开(公告)日:2011-05-05
申请号:US13005796
申请日:2011-01-13
Applicant: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
Inventor: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
IPC: H01R13/44
CPC classification number: H01R13/5213 , G06F1/1616 , G06F1/1656 , G06F1/1675 , H01R2201/06
Abstract: An electronic device with a hidden I/O interface module is disclosed. The electronic device includes a container and a surface with an opening, container and the opening communicate with each other. The container includes a first position and a second position. The electronic device also includes an I/O connection unit, a pivot module and a cover. The I/O connection unit is disposed at the container, electrically connected to the electronic device and includes a connecting surface. The pivot module is connected to the I/O connection unit. The cover is connected to the pivot module. When the cover is shut, it covers the container and makes the I/O connection unit located at the first position. When the cover is open, it drives the pivot module to drive the I/O connection unit to move to the second position to make the connecting surface of the I/O connection unit aligned with the surface.
Abstract translation: 公开了具有隐藏I / O接口模块的电子设备。 电子装置包括容器和具有开口,容器和开口彼此连通的表面。 容器包括第一位置和第二位置。 电子设备还包括I / O连接单元,枢轴模块和盖。 I / O连接单元设置在容器上,电连接到电子设备并且包括连接表面。 枢轴模块连接到I / O连接单元。 盖子连接到枢轴模块。 当盖子关闭时,它盖住容器并使I / O连接单元位于第一位置。 当盖子打开时,它驱动枢轴模块以驱动I / O连接单元移动到第二位置,以使I / O连接单元的连接表面与表面对齐。
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公开(公告)号:US07891995B2
公开(公告)日:2011-02-22
申请号:US12707141
申请日:2010-02-17
Applicant: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
Inventor: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
CPC classification number: H01R13/5213 , G06F1/1616 , G06F1/1656 , G06F1/1675 , H01R2201/06
Abstract: An electronic device with a hidden I/O interface module is disclosed. The electronic device includes a container and a surface with an opening, container and the opening communicate with each other. The container includes a first position and a second position. The electronic device also includes an I/O connection unit, a pivot module and a cover. The I/O connection unit is disposed at the container, electrically connected to the electronic device and includes a connecting surface. The pivot module is connected to the I/O connection unit. The cover is connected to the pivot module. When the cover is shut, it covers the container and makes the I/O connection unit located at the first position. When the cover is open, it drives the pivot module to drive the I/O connection unit to move to the second position to make the connecting surface of the I/O connection unit aligned with the surface.
Abstract translation: 公开了具有隐藏I / O接口模块的电子设备。 电子装置包括容器和具有开口,容器和开口彼此连通的表面。 容器包括第一位置和第二位置。 电子设备还包括I / O连接单元,枢轴模块和盖。 I / O连接单元设置在容器上,电连接到电子设备并且包括连接表面。 枢轴模块连接到I / O连接单元。 盖子连接到枢轴模块。 当盖子关闭时,它盖住容器并使I / O连接单元位于第一位置。 当盖子打开时,它驱动枢轴模块以驱动I / O连接单元移动到第二位置,以使I / O连接单元的连接表面与表面对齐。
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公开(公告)号:US07922502B1
公开(公告)日:2011-04-12
申请号:US13005796
申请日:2011-01-13
Applicant: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
Inventor: Kuan-Ting Chen , Chao-Ming Chu , Yi-Ting Chen
CPC classification number: H01R13/5213 , G06F1/1616 , G06F1/1656 , G06F1/1675 , H01R2201/06
Abstract: An electronic device with a hidden I/O interface module is disclosed. The electronic device includes a container and a surface with an opening, container and the opening communicate with each other. The container includes a first position and a second position. The electronic device also includes an I/O connection unit, a pivot module and a cover. The I/O connection unit is disposed at the container, electrically connected to the electronic device and includes a connecting surface. The pivot module is connected to the I/O connection unit. The cover is connected to the pivot module. When the cover is shut, it covers the container and makes the I/O connection unit located at the first position. When the cover is open, it drives the pivot module to drive the I/O connection unit to move to the second position to make the connecting surface of the I/O connection unit aligned with the surface.
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公开(公告)号:US11874713B2
公开(公告)日:2024-01-16
申请号:US17880602
申请日:2022-08-03
Applicant: Wei-Ting Chen , Tzu-Chien Lai , I-Hsuan Tsai , Chien Chiu , I-Lung Chen , Tsai-Sheng Yang
Inventor: Wei-Ting Chen , Tzu-Chien Lai , I-Hsuan Tsai , Chien Chiu , I-Lung Chen , Tsai-Sheng Yang
CPC classification number: G06F1/206 , G06F1/1616 , G06F1/1666 , G06F1/1681 , G06F1/203 , H05K7/20154 , H05K7/20172 , H05K7/20209
Abstract: An electronic device includes a first body including a first part and a second part hinged to each other, a second body, and a hinge structure hinged between an edge of the second body and the second part. The first part has a recess. When the second body is unfolded relative to the first body from a folded state to a first unfolded state, the hinge structure pushes against the first part to rotate the first part relative to the second part. When the second body is continuously unfolded relative to the first body from the first unfolded state to a second unfolded state, the edge of the second body pushes against the first part, so that the first part continues to rotate relative to the second part. When the second body is in the folded state, the hinge structure is at least partially accommodated in the recess.
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公开(公告)号:US11606702B2
公开(公告)日:2023-03-14
申请号:US16986282
申请日:2020-08-06
Applicant: Li-Chun Lee , Shih-Chia Liu , Jhin-Ciang Chen , Jui-Hung Lai , Peng-Hsiang Sung , Hsiang-Pin Yang , Sheng-Ju Yu , Kuan-Ting Chen , Hung-Han Sun
Inventor: Li-Chun Lee , Shih-Chia Liu , Jhin-Ciang Chen , Jui-Hung Lai , Peng-Hsiang Sung , Hsiang-Pin Yang , Sheng-Ju Yu , Kuan-Ting Chen , Hung-Han Sun
Abstract: An electronic device and a method for adjusting an adjustable antenna are provided. The electronic device includes a storage medium, an antenna switch, a wireless local area network (WLAN) card, and a processor. The storage medium stores multiple system modules. The antenna switch is coupled to the adjustable antenna. The WLAN card is coupled to the antenna switch and obtains a communication signal from the adjustable antenna. The communication signal includes channel information. The processor is coupled to the storage medium, the antenna switch, and the WLAN card. The processor accesses and executes the multiple system modules including an operation system (OS) and a signal capturing module. The OS obtains the channel information from the WLAN card. The signal capturing module obtains the channel information from the OS and configures the antenna switch according to the channel information to adjust the antenna performance of the adjustable antenna.
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公开(公告)号:USD951591S1
公开(公告)日:2022-05-17
申请号:US29754436
申请日:2020-10-11
Applicant: Yi-Ting Chen
Designer: Yi-Ting Chen
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公开(公告)号:USD909992S1
公开(公告)日:2021-02-09
申请号:US29661043
申请日:2018-08-24
Applicant: Yen-Hsiao Yeh , Tzu-Chien Lai , Wei-Ting Chen
Designer: Yen-Hsiao Yeh , Tzu-Chien Lai , Wei-Ting Chen
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公开(公告)号:US10885398B2
公开(公告)日:2021-01-05
申请号:US16326141
申请日:2018-03-16
Applicant: Chien-Yi Wang , Athmanarayanan Lakshmi Narayanan , Yi-Ting Chen
Inventor: Chien-Yi Wang , Athmanarayanan Lakshmi Narayanan , Yi-Ting Chen
Abstract: The present disclosure generally relates to methods and systems for identifying objects from a 3D point cloud and a 2D image. The method may include determining a first set of 3D proposals using Euclidean clustering on the 3D point cloud and determining a second set of 3D proposals from the 3D point cloud based on a 3D convolutional neural network. The method may include pooling the first and second sets of 3D proposals to determine a set of 3D candidates. The method may include projecting the first set of 3D proposals onto the 2D image and determining a first set of 2D proposals using 2D convolutional neural network. The method may include pooling the projected first set of 3D proposals and the first set of 2D proposals to determine a set of 2D candidates then pooling the set of 3D candidates and the set of 2D candidates.
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