公开(公告)号：US20080174224A1

公开(公告)日：2008-07-24

申请号：US11727189

申请日：2007-03-23

Applicant: Jui-Tsung Liao ,  Tai-Ho Huang ,  Tung-Ching Wu

Inventor： Jui-Tsung Liao ,  Tai-Ho Huang ,  Tung-Ching Wu

IPC: H01J5/50

CPC classification number: H01J5/50 ,  F21K9/232 ,  F21V3/00 ,  F21V19/003 ,  F21Y2105/10 ,  F21Y2107/90 ,  F21Y2115/10

Abstract: A lamp head structure comprises a base and a circuit board. The base has an opening on the bottom and an open slot on at least one side. The circuit board has a respective electrically conducting layer on the bottom surface and at least one lateral surface. The circuit board is located inside the open slot of the base. The electrically conducting layer on the bottom surface of the circuit board is located corresponding to the opening on the bottom of the base. At least one light-emitting device is coupled to the circuit board. A positive electrode and a negative electrode of the light-emitting device are connected to the circuit board. The circuit board is coupled to the base to effectively simplify manufacture process and allow convenient repair.

Abstract translation: 灯头结构包括基座和电路板。 底座在底部有一个开口，至少在一侧有一个敞开的槽。 电路板在底表面和至少一个侧表面上具有相应的导电层。 电路板位于基座的开口槽内。 电路板底面上的导电层位于底座底部的开口处。 至少一个发光装置耦合到电路板。 发光装置的正极和负极与电路基板连接。 电路板耦合到基座，以有效地简化制造过程并允许便于维修。

公开(公告)号：US20080111140A1

公开(公告)日：2008-05-15

申请号：US11599595

申请日：2006-11-15

Applicant: Ching-Huei Wu ,  Tung-Ching Wu

Inventor： Ching-Huei Wu ,  Tung-Ching Wu

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode comprises: a coupling base; a plurality of light-emitting chips; and a sealant, wherein a plurality of frame pairs having an amount corresponding to that of the light-emitting chips are mounted inside the coupling base. The frame pairs have a plurality of first and second frames having different areas. The light-emitting chips are respectively coupled with a plurality of large-area coupling parts of the first frames, and the light-emitting chips are electrically connected with the second frames, respectively. The coupling base is packaged by the sealant. Accordingly, the volume of the light-emitting diode can be reduced significantly.

Abstract translation: 发光二极管包括：耦合基座; 多个发光芯片; 以及密封剂，其中具有对应于发光芯片的量的多个框架对安装在联接基座的内部。 帧对具有多个具有不同区域的第一和第二帧。 发光芯片分别与第一框架的多个大面积耦合部分耦合，并且发光芯片分别与第二框架电连接。 联接基座由密封剂包装。 因此，可以显着降低发光二极管的体积。

公开(公告)号：US20080105884A1

公开(公告)日：2008-05-08

申请号：US11592236

申请日：2006-11-03

Applicant: Ching-Huei Wu ,  Yuan-Cheng Chin ,  Tung-Ching Wu

Inventor： Ching-Huei Wu ,  Yuan-Cheng Chin ,  Tung-Ching Wu

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00

Abstract: A light-emitting diode comprises: a coupling base; several light-emitting chips; and an adhesive for sealing the coupling base, wherein the coupling base has a coupling part and at least two frame pairs mounted therein. The light-emitting chips are fixed on the coupling part. The light-emitting chips are electrically connected with these two frame pairs, which are controlled by two control terminals simultaneously.

Abstract translation: 发光二极管包括：耦合基座; 几个发光芯片; 以及用于密封联接基座的粘合剂，其中所述联接基座具有联接部件和安装在其中的至少两个框架对。 发光芯片固定在耦合部分上。 发光芯片与这两个框架对电连接，由两个控制端子同时控制。

公开(公告)号：US20070131940A1

公开(公告)日：2007-06-14

申请号：US11296498

申请日：2005-12-08

Applicant: Tung-Ching Wu ,  Ching-Huei Wu

Inventor： Tung-Ching Wu ,  Ching-Huei Wu

IPC: H01L33/00 ,  H01L31/12 ,  H01L27/15 ,  H01L29/26

CPC classification number: H01L33/505 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A color-mixing LED is disclosed. Fluorescent powders are mixed with an adhesive to form a thin plate. A segmentation process is then performed on the thin plate. A chip is coupled to a concave bracing frame, and then the segmented thin plate is mounted in the concave bracing frame against its inner walls. A transparent adhesive for fixing is injected into the concave bracing frame, whereby the color-mixing LED has simplified manufacturing procedure, reduced manufacturing cost, and easy assembling design.

Abstract translation: 公开了一种混色LED。 将荧光粉与粘合剂混合以形成薄板。 然后在薄板上进行分割处理。 芯片耦合到凹形支撑框架，然后分割的薄板被安装在凹形支撑框架中抵靠其内壁。 用于固定的透明粘合剂被注入到凹形支撑框架中，由此混色LED具有简化的制造程序，降低了制造成本，并且易于组装设计。

公开(公告)号：US20080197364A1

公开(公告)日：2008-08-21

申请号：US11783277

申请日：2007-04-06

Applicant: Ching-Huei Wu ,  Tung-Ching Wu

Inventor： Ching-Huei Wu ,  Tung-Ching Wu

IPC: H01L33/00

CPC classification number: H05B33/14 ,  C09K11/7734 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A light-emitting device comprises a support frame and at least one blue light-emitting chip and at least one red light-emitting chip coupled onto the support frame; and a green phosphor covering the at least one blue light-emitting chip and the at least one red light-emitting chip. The green phosphor is mainly an aluminate of the formula: M1.xEuxAlyO1+3y/2, wherein M is at least one divalent metal selected from a group consisting of Ba, Sr, Ca, Mg, Mn, Zn, Cu, Cd, Sm and Tm; 0.1

Abstract translation: 发光装置包括支撑框架和耦合到支撑框架上的至少一个蓝色发光芯片和至少一个红色发光芯片; 以及覆盖所述至少一个蓝色发光芯片和所述至少一个红色发光芯片的绿色荧光体。 绿色荧光体主要是下列化学式的铝酸盐：M 1 x O 1 x 3 O 1 + 3y / 2 < 其中M是选自Ba，Sr，Ca，Mg，Mn，Zn，Cu，Cd，Sm和Tm中的至少一种二价金属; 0.1

公开(公告)号：US20080180949A1

公开(公告)日：2008-07-31

申请号：US11727412

申请日：2007-03-26

Applicant: Jui-Tsung Liao ,  Tai-Ho Huang ,  Tung-Ching Wu

Inventor： Jui-Tsung Liao ,  Tai-Ho Huang ,  Tung-Ching Wu

IPC: F21V21/00

CPC classification number: F21V21/088 ,  F21S4/20 ,  F21W2121/00 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: An illumination structure comprises a FPC (Flexible Printed Circuit) board, several light-emitting diodes and at least one pair of coupling device. The light-emitting diodes are coupled to the FPC board. The at least one pair of coupling device is mounted on respective opposite sides of the FPC board to allow the planar FPC board to be transformed into a three-dimensional shape.

Abstract translation: 照明结构包括FPC（柔性印刷电路）板，几个发光二极管和至少一对耦合装置。 发光二极管耦合到FPC板。 所述至少一对耦合装置安装在所述FPC板的相对的相对侧上，以使得所述平面FPC板被转换为三维形状。