公开(公告)号：US12132157B2

公开(公告)日：2024-10-29

申请号：US18490139

申请日：2023-10-19

申请人： NICHIA CORPORATION

发明人： Takeshi Tamura

IPC分类号： H01L33/60 ,  G02F1/13357 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC分类号： H01L33/60 ,  G02F1/133603 ,  G02F1/133611 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  G02F1/133606 ,  H01L2933/0091

摘要： A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

公开(公告)号：US20240355991A1

公开(公告)日：2024-10-24

申请号：US18763447

申请日：2024-07-03

申请人： Seoul Viosys Co., Ltd.

发明人： Jong Min JANG ,  Chang Yeon KIM

IPC分类号： H01L33/62 ,  H01L27/15 ,  H01L33/24 ,  H01L33/50

CPC分类号： H01L33/62 ,  H01L27/15 ,  H01L33/24 ,  H01L33/50

摘要： A light emitting device including a first light emitting part, a second light emitting part disposed on a first surface of the first light emitting part, and a third light emitting part disposed on a first surface of the second light emitting part, a first contact member contacting a surface of a second n-type semiconductor layer of the second light emitting part, an ohmic electrode electrically connected to a third p-type semiconductor layer of the third light emitting part, and an adhesive layer disposed between the second light emitting part and the third light emitting part, in which the first contact member extends toward the first light emitting part to be electrically connected to a first n-type semiconductor layer of the first light emitting part, and the adhesive layer extends toward the ohmic electrode.

公开(公告)号：US20240349407A1

公开(公告)日：2024-10-17

申请号：US18756737

申请日：2024-06-27

申请人： Seoul Semiconductor Co., Ltd.

发明人： Chung Hoon LEE

IPC分类号： H05B45/20 ,  G09G3/20 ,  G09G3/32 ,  H01L33/50 ,  H05B45/22

CPC分类号： H05B45/20 ,  G09G3/2003 ,  G09G3/32 ,  H01L33/50 ,  H05B45/22

摘要： A lighting device including a first light emitter including a plurality of light sources each being configured to emit light with a different color temperature, a second light emitter including at least one light emitting structure to emit light having a different color range than that emitted from the first light emitter, a controller to adjust characteristics of light emitted from the first and second light emitters, a user interface member configured to receive input of a user and connected to the controller, and a storage medium connected to the controller, in which each of the light sources includes a light-emitting diode chip and a wavelength conversion member to convert a wavelength range of light emitted from the light-emitting diode chip, and the controller is further configured to control the first and second light emitters according to a spectrum of light stored in the storage medium.

公开(公告)号：US20240332342A1

公开(公告)日：2024-10-03

申请号：US18741784

申请日：2024-06-13

申请人： Innolux Corporation

发明人： Yi-An Chen ,  Wan-Ling Huang ,  Tsau-Hua Hsieh

IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58

CPC分类号： H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58

摘要： The electronic device includes a first substrate, a second substrate, a first light emitting diode, a second light emitting diode, a first optical structure and a second optical structure. The second substrate is disposed opposite to the first substrate. The first light emitting diode and the second light emitting diode are disposed between the first substrate and the second substrate and adjacent to each other. The first optical structure and the second optical structure are disposed between the first substrate and the second substrate. A light emitted from the first light emitting diode passes through the first optical structure to provide a blue light, a light emitted from the second light emitting diode passes through the second optical structure to provide a light having a color different from blue, and the first optical structure comprises a scattering element.

公开(公告)号：US12095012B2

公开(公告)日：2024-09-17

申请号：US17377784

申请日：2021-07-16

申请人： EPISTAR CORPORATION ,  Yenrich Technology Corporation

发明人： Min-Hsun Hsieh ,  Kunal Kashyap

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/54

CPC分类号： H01L33/54 ,  H01L33/0093 ,  H01L33/50 ,  H01L33/007 ,  H01L2933/0041 ,  H01L2933/005

摘要： A light-emitting device includes a semiconductor stack, a first electrode, a second electrode, and a supporting layer. The semiconductor stack includes a first semiconductor layer including a first top surface and a bottom surface, an active layer located on the first semiconductor layer, and a second semiconductor layer located on the active layer and including a second top surface. The first electrode is located on the first top surface. The second electrode is located on the second top surface. The supporting layer includes a first thickness, and directly covers at least 80% of the bottom surface. In a top view, the semiconductor stack includes a maximum length, and a ratio of the maximum length to the first thickness is smaller than 1. The supporting layer has a first thermal expansion coefficient smaller than 80 ppm/° C., and the supporting layer has a Young's modulus between 2˜10 GPa.

公开(公告)号：US12087806B2

公开(公告)日：2024-09-10

申请号：US17483060

申请日：2021-09-23

申请人： Samsung Display Co., LTD.

发明人： Ki Yeup Lee ,  Sang Yong No ,  Ji Yeon Choi ,  Tae Ho Kang ,  Hwa Rang Lee

IPC分类号： H01L27/15 ,  H01L23/60 ,  H01L33/48 ,  H01L33/50

CPC分类号： H01L27/156 ,  H01L23/60 ,  H01L33/483 ,  H01L33/50

摘要： A display device includes a first substrate including a display area comprising pixels, and a non-display area surrounding the display area, a thin film transistor layer disposed on the first substrate and comprising a thin film transistor, a second substrate disposed on the thin film transistor layer and facing the first substrate, a sealing part disposed between the first substrate and the second substrate in the non-display area, and bonding the first and second substrates, a metal line disposed in the non-display area on the thin film transistor layer and overlapping the sealing part, and an antistatic member comprising a support supported by the metal line, a first receiver protruding from a top portion of the support to an exterior of the sealing part, and a second receiver protruding from a bottom portion of the support toward the exterior of the sealing part and facing the first receiver.

公开(公告)号：US20240297162A1

公开(公告)日：2024-09-05

申请号：US18663754

申请日：2024-05-14

申请人： Zhongshan Mulinsen Electronics Co., Ltd.

发明人： Baoqing PI ,  Xuezhao HE ,  Lei ZHU

IPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0091

摘要： A new type of LED light, related to a technical field of LED, including a cup body. The cup body includes a first light-emitting assembly, a second light-emitting assembly and a third light-emitting assembly. The first light-emitting assembly is used to emit green light, the second light-emitting assembly is used to emit blue light, and the third light-emitting assembly is used to emit blue light. A first phosphor layer is provided on the second light-emitting assembly or the third light-emitting assembly, so that the blue light emitted by the second light-emitting assembly or the third light-emitting assembly is transformed into red light after passing through the first phosphor layer. The present disclosure emits red light through a combination of blue light and a phosphor layer, replacing traditional red lights, improving the performance of the new type of LED light and reducing costs.

公开(公告)号：US12080690B2

公开(公告)日：2024-09-03

申请号：US18507597

申请日：2023-11-13

申请人： X Display Company Technology Limited

发明人： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC分类号： H01L25/075 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/482 ,  H01L23/538 ,  H01L25/16 ,  H01L27/15 ,  H01L33/36 ,  H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  F21Y105/10 ,  F21Y113/13 ,  F21Y115/10 ,  H01L33/20 ,  H01L33/40

CPC分类号： H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L33/20 ,  H01L33/405 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

摘要： The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US12080585B2

公开(公告)日：2024-09-03

申请号：US18312641

申请日：2023-05-05

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kyungwook Hwang ,  Junsik Hwang

IPC分类号： H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62

CPC分类号： H01L21/6835 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

摘要： A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

公开(公告)号：US12072073B2

公开(公告)日：2024-08-27

申请号：US17673520

申请日：2022-02-16

申请人： LUMILEDS LLC

发明人： Georg Henninger ,  Benno Spinger ,  Marcus Jozef Henricus Kessels ,  Matthias Epmeier ,  Floris Maria Hermansz Crompvoets

IPC分类号： F21S41/151 ,  F21K9/68 ,  F21S41/148 ,  F21S41/19 ,  F21S41/30 ,  F21Y103/10 ,  F21Y115/10 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46 ,  H01L33/50 ,  H01L33/62 ,  F21S45/47

CPC分类号： F21S41/151 ,  F21K9/68 ,  F21S41/148 ,  F21S41/192 ,  F21S41/30 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/46 ,  H01L33/50 ,  H01L33/505 ,  F21S45/47 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/0095 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0041

摘要： A method for manufacturing light emitting elements is described and includes providing an un-coated light converting platelet. The un-coated light converting platelet has a top surface, a bottom surface, and side surfaces. A plurality of LED dies is provided. Side surfaces of the un-coated light converting platelet are coated with an at least partly reflective material to form a coated light converting platelet. The coated light converting platelet is separated into light converting tiles. An outline of the light converting tiles substantially corresponds to an outline of one of the plurality of LED dies. The light converting tiles and the plurality of LED dies are assembled to form light emitting elements.